Micro-component Packaging Process Using Metal Layer Sealing
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Solution Overview
Problem
The packaging of micro-electromechanical systems is a complex and costly process due to existing manufacturing techniques, which are inefficient and prone to defects.
Innovation Solution
A packaging process involving a cover plate with a metal layer that forms a contact interface with the wafer, applying pressure and heating to create a seal, and using electromagnetic radiation through a transparent layer to seal cavities, with a heat shield to protect micro-components from radiation damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional packaging techniques are used for micro-electromechanical systems, then the packaging process can be performed with existing equipment, but the process becomes long, complex and expensive
Solution Approach 1:
The patent combines multiple packaging operations (sealing, bonding, and encapsulation) into a single integrated process step. The cover plate simultaneously seals multiple cavities and bonds to the substrate wafer in one operation, eliminating the need for separate processing steps and reducing overall process complexity
Solution Approach 2:
The cover plate serves multiple functions simultaneously: it acts as a sealing barrier for cavities, a bonding interface with the substrate, and a protective enclosure for micro-components. This multi-functionality reduces the number of separate components and process steps required
2Manufacturing precision
If electromagnetic radiation is applied to seal metal layers, then sealing speed and precision are improved, but micro-components may be damaged by radiation
Solution Approach 1:
The patent applies electromagnetic radiation selectively only to the metal layer regions that require sealing, rather than irradiating the entire wafer surface. The radiation is confined to specific localized areas where sealing is needed, leaving micro-components in non-irradiated zones undamaged
Solution Approach 2:
The metal layer acts as an intermediary that absorbs electromagnetic radiation and converts it to thermal energy for sealing purposes. This intermediary layer protects micro-components by absorbing the radiation before it can reach and damage them, while still enabling precise sealing of the cavities
3Reliability
If a cover plate is used to enclose micro-components, then protection and sealing are improved, but the packaging process becomes more complex
Solution Approach 1:
The cover plate is designed with a uniform metal layer deposited across its entire surface, creating consistent sealing properties throughout. This homogeneous structure simplifies the sealing process compared to using multiple different materials or complex multi-layer structures, while maintaining high sealing reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This process reduces the complexity and cost of packaging micro-components by creating reliable seals around micro-electromechanical systems, enhancing protection and efficiency while minimizing defects.
Implementation Method 1
heating the metal layer(s) at the contact interface by irradiating the metal layer or each metal layer in the contact interface by electromagnetic radiation absorbed by this metal layer
Implementation Method 2
each micro-component being protected from electromagnetic radiation by a heat shield arranged on a face of the transparent layer
Implementation Method 3
through at least one layer transparent to this radiation, this transparent layer being composed of at least the wafer or the cover plate
Data Source
AI summary
A process for packaging a plurality of micro-components made on the same substrate wafer, in which each micro-component is enclosed in a cavity. This process includes making a cover plate; depositing a metal layer on a face of the cover plate or on a face of the wafer; covering the wafer with the cover plate; applying a contact pressure equal to at least one bar onto the cover plate and onto the wafer; and heating the metal layer during pressing until a seal is obtained, each cavity thus being provided with a sealing area and being closed by a part of the cover plate and/or its metal layer.