Micro-Component Transfer Head Asymmetric Carrying Surface
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Solution Overview
Problem
Conventional micro-component transfer heads struggle to efficiently extract micro-LEDs from wafers due to a mismatch in shape between the carrying surface and the wafer, leading to incomplete extraction and reduced production efficiency.
Innovation Solution
A micro-component transfer head with a carrying surface that conforms to a non-rectangular geometric object, such as a triangular or circular sector shape, allowing for closer access to the wafer margins and improved extraction efficiency, along with a micro-component transfer device that rotates the wafer to align extraction areas with the center, facilitating mass transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a conventional rectangular or square carrying surface is used, then the structure is simple and easy to manufacture, but the extraction area cannot fully cover the circular wafer surface, leaving micro-LEDs at the margins unextracted
Solution Approach 1:
The carrying surface is designed with an asymmetric circular shape that matches the circular geometry of the wafer, allowing the extraction area to cover the entire wafer surface including margins. This asymmetric design resolves the contradiction by optimizing the shape for maximum wafer coverage while maintaining manufacturing feasibility through standard circular patterning techniques.
2Productivity
If the carrying surface contacts the wafer multiple times for mass transfer, then transfer efficiency increases, but micro-LEDs at the wafer margins remain inaccessible due to shape mismatch
Solution Approach 1:
The circular carrying surface geometry is specifically designed to match the circular wafer shape, enabling complete coverage during multiple contact transfers. This allows all micro-LEDs including those at the margins to be extracted reliably, resolving the contradiction between transfer efficiency and extraction completeness.
Solution Approach 2:
The carrying surface is pre-configured with a circular shape that anticipates the wafer geometry, ensuring that during the mass transfer process, all areas of the wafer including margins are accessible for extraction. This preliminary design prevents extraction failures before they occur.
3Manufacturing precision
If micro-LEDs are extracted one at a time, then extraction precision is maintained, but the process becomes time-consuming and reduces production efficiency
Solution Approach 1:
Multiple micro-LED extraction operations are merged into a single mass transfer process. The circular carrying surface enables simultaneous extraction of numerous micro-LEDs from the wafer in one operation, maintaining precision through controlled contact while dramatically improving production efficiency by eliminating sequential extraction.
Solution Approach 2:
The mass transfer process enables continuous extraction of micro-LEDs across the entire wafer surface in a single uninterrupted operation. The circular carrying surface maintains continuous contact with the wafer, ensuring that extraction precision is preserved while productivity increases through eliminated idle time between individual extractions.
Data Source
AI summary
Herein disclosed are a micro-component transfer head, a micro-component transfer device, and a micro-component display. Said micro-component transfer head comprises a carrying surface that corresponds to a micro-component extraction area. Said extraction area conforms with a first geometric object, which comprises at least an acute angle. A second geometric object comprises at least a right angle and is constituted of n copies of the first geometric object, n being an integer greater than 1. The shape of the first geometric object differs from that of the second.