Micro Component Transfer via Sacrificial Layer Removal
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Solution Overview
Problem
The conventional methods for transferring micro components, such as semiconductor induction apparatuses and light emitting diode display systems, face challenges in process yield and efficiency due to complex bonding processes, particularly in indirect bonding methods which require multiple steps and can lead to inefficiencies and component damage.
Innovation Solution
A method involving the formation of sacrificial and support layers on a carrier substrate, where sacrificial layers are removed to create a micro component support structure that allows for the secure transfer of micro components using a transfer apparatus, enabling efficient bonding and reducing the risk of component damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If indirect bonding method is used to transfer micro component, then micro component can be transferred from carrier substrate to receiving substrate, but the process requires multiple steps (extracting, bonding, removing transfer apparatus) which reduces process efficiency and productivity
Solution Approach 1:
The invention extracts and removes the transfer apparatus from the bonding process entirely. Instead of using a transfer apparatus to extract and bond micro components, the patent uses direct wafer bonding where the micro component array bonds directly from the carrier substrate to the receiving substrate, eliminating the need for transfer apparatus extraction and bonding steps.
Solution Approach 2:
The invention merges the transfer and bonding operations into a single direct bonding step. The carrier substrate itself serves as the transfer medium, combining the functions of holding and transferring micro components with the bonding process, thereby eliminating separate extraction and bonding steps.
2Reliability
If indirect bonding method is used to transfer micro component, then micro component can be transferred, but multiple bonding/splitting operations are required which increases process complexity and time consumption
Solution Approach 1:
The invention extracts and eliminates the transfer apparatus from the process, allowing direct bonding between carrier substrate and receiving substrate. This removes the need for multiple bonding and splitting operations, reducing process time to a single bonding step followed by simple carrier removal.
Solution Approach 2:
Instead of using a separate transfer apparatus to mediate the transfer, the invention inverts the approach by using the carrier substrate itself as the bonding medium. The carrier substrate directly bonds to the receiving substrate, and the micro components are transferred along with the carrier substrate, which is then removed.
3Productivity
If conventional wafer bonding is used, then micro component array can be bonded directly, but the carrier substrate must be removed after bonding which adds process steps and potential for damage
Solution Approach 1:
The invention extracts and removes the transfer apparatus from the process entirely. The carrier substrate is designed to be removable after bonding, but the key innovation is eliminating the need for complex transfer apparatus extraction and handling steps that previously followed bonding.
Solution Approach 2:
The invention performs preliminary preparation of the carrier substrate with sacrificial layers and support structures before bonding. The sacrificial layers are pre-formed to facilitate easy carrier removal after bonding, and support structures are pre-positioned to protect micro components during the removal process.
Data Source
AI summary
A display panel and a method for forming a micro component support are provided. The method for forming a micro component support includes the following steps. First, a first sacrificial layer is formed on a carrier substrate, where the first sacrificial layer includes a plurality of first openings, and the first openings expose the carrier substrate. Then, a first support layer is formed on the first sacrificial layer and in the first openings. Next, a second sacrificial layer is formed on the first sacrificial layer and the first support layer, where the second sacrificial layer includes a plurality of second openings, and the second openings expose the first support layer. Then, a second support layer is formed on the second sacrificial layer and in the second openings. Next, at least one micro component is formed on the second support layer. Finally, the first sacrificial layer and the second sacrificial layer are removed.