Micro Semiconductor Conductor Array for Precise Eutectic Bonding

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Solution Overview

Problem

Conventional methods for forming electrical connections for micron-scaled or smaller micro semiconductor structures, such as μLEDs, are inadequate due to the limitations of conventional wire bonding or eutectic bonding machines.

Innovation Solution

An electronic device and manufacturing method utilizing a conductor array formed by eutectic bonding of conductive pads and electrodes, with a nonconductive connection layer surrounding the conductors, allowing for electrical connection of micro semiconductor structures to a target substrate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional wire bonding or eutectic bonding machines are used for μLEDs, then electrical connection can be formed for larger LEDs, but the machines cannot handle micron-scaled or smaller micro semiconductor structures

Engineering Contradiction:

Improveconnection precision for micron-scaled structuresVSAvoidapplicability to different scales of semiconductor structures

Core Design Contradiction:

Manufacturing precisionVSAdaptability or versatility

Solution Approach 1:

The bonding process is segmented into two distinct stages: first bonding the conductive pad to the target substrate, then bonding the conductive electrode to the conductive pad. This segmentation allows each bonding operation to be optimized independently, enabling precise connection of micron-scaled structures while maintaining versatility across different device sizes.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The conductive pad is preliminarily bonded to the target substrate before the micro semiconductor structure is attached. This preliminary action establishes a stable foundation and positioning reference, enabling subsequent precise bonding of the micron-scaled structure without requiring the bonding machine to handle the entire assembly in one operation.

Inventive Principle:

Principle #10Preliminary action

2Reliability

If conventional bonding methods are used, then electrical connection is achieved, but manufacturing time and costs are high

Engineering Contradiction:

Improvestability of electrical connectionVSAvoidmanufacturing efficiency

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

Multiple bonding operations are merged into a single integrated process where the conductive pad, micro semiconductor structure, and target substrate are bonded together in one continuous operation. This merging eliminates intermediate handling steps, reduces manufacturing time, and maintains connection reliability by avoiding repeated bonding cycles.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The conductive pad serves dual functions: it acts as both the bonding interface to the target substrate and the electrical connection element to the micro semiconductor structure. This self-service approach eliminates the need for separate connection elements, reducing manufacturing complexity and cost while maintaining reliable electrical connection.

Inventive Principle:

Principle #25Self-service

3Reliability

If conventional bonding approaches are used, then electrical connection is formed, but the process is complex and costly

Engineering Contradiction:

Improvebonding stabilityVSAvoidcomplexity of bonding process

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The conductive pad is extracted as a separate, pre-formed element that is independently bonded to the target substrate before the micro semiconductor structure is attached. This extraction simplifies the overall process by separating the positioning function (handled by the pad-substrate bond) from the electrical connection function (handled by the electrode-pad bond), reducing process complexity while maintaining bonding stability.

Inventive Principle:

Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Provides a cost-effective and efficient electrical connection solution for micro semiconductor structures, reducing manufacturing time and costs while ensuring stable bonding.

Implementation Method 1

Each of the conductors is an integrated member formed by eutectic bonding a conductive pad of the target substrate and a conductive electrode of a corresponding one of the micro semiconductor structures

Methodology Applied

Scientific EffectEutectic bonding:

Data Source

PatentUSRE50719E1Electronic device

Publication Date: 2025.12.30 LG DISPLAY CO LTD

AI summary

An electronic device comprises a target substrate, a micro semiconductor structure array, a conductor array, and a connection layer. The micro semiconductor structure array is disposed on the target substrate. The conductor array corresponds to the micro semiconductor structure array, and electrically connects the micro semiconductor structure array to a pattern circuit of the target substrate. The conductors of the conductor array are independent from one another. Each conductor is an integrated member formed by eutectic bonding a conductive pad of the target substrate and a conductive electrode of the corresponding one of the micro semiconductor structures of the micro semiconductor structure array. The connection layer connects the micro semiconductor structures to the target substrate. The connection layer excludes a conductive material. The connection layer contacts and surrounds the conductors, so that the connection layer and the conductors together form a one-layer structure.