Micro Crystal Oscillator Wire Bonding via Tank Vias
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Solution Overview
Problem
The increasing miniaturization of oscillators poses a challenge for manufacturers as existing wire bonding technology, suitable for large-size packaging, is not efficiently adaptable to smaller sizes, leading to high production costs due to the need for equipment replacement to flip-chip bonding technology.
Innovation Solution
A micro crystal oscillator design that utilizes wire bonding technology by structurally integrating patterned electrodes and circuits within a tank body, allowing electrical connection of an oscillating chip through vias and connecting wires, enabling the application of wire bonding to millimeter-sized packages without requiring new equipment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If wire bonding technology is used for large-size packaging, then manufacturing cost is low and process is mature, but it cannot be efficiently applied to small-size packages
Solution Approach 1:
The patent transitions from planar bonding to three-dimensional wire bonding by utilizing the vertical dimension within the tank body. The wire bonding structure extends in multiple spatial dimensions, allowing efficient electrical connections in compact millimeter-sized packages while maintaining the cost advantages of wire bonding technology.
Solution Approach 2:
The wire bonding structure is nested within the tank body, with connecting wires routed through the internal space to connect the oscillating chip to external electrodes. This nesting approach maximizes the use of available space in small-size packages while maintaining wire bonding compatibility.
2Adaptability or versatility
If packaging equipment is replaced from wire bonding to flip-chip bonding for small-size packages, then packaging capability is improved, but production cost increases greatly
Solution Approach 1:
The patent makes wire bonding technology universal by designing a wire bonding structure that can handle both traditional larger packages and modern millimeter-sized packages. This multi-functionality allows existing wire bonding equipment to produce small-size oscillators without requiring expensive flip-chip bonding equipment replacement.
Solution Approach 2:
The invention changes the parameters of wire bonding application by adapting the bonding pitch, wire routing paths, and electrode configurations to suit millimeter-sized packages. These parameter adjustments enable wire bonding to effectively package small oscillators while maintaining cost efficiency.
3Volume of moving object
If oscillator size is reduced for miniaturization, then product compactness is improved, but wire bonding efficiency deteriorates
Solution Approach 1:
The wire bonding structure is dynamically optimized for small sizes by adjusting wire lengths, bonding positions, and routing configurations to match the compact dimensions. This dynamic adaptation maintains bonding efficiency despite the reduced oscillator size.
Solution Approach 2:
The patent applies local quality optimization by concentrating electrical connections in specific regions of the oscillating chip and tank body, reducing the overall wire length and bonding complexity in millimeter-sized packages while maintaining necessary electrical connectivity.
Data Source
AI summary
A micro crystal oscillator includes: a tank body including a tank bottom and a side wall, the tank bottom including an inner surface and an outer surface, wherein the side wall is disposed on a periphery of the inner surface of the tank bottom to form a recess together with the tank bottom; a plurality of patterned electrodes arranged on the outer surface; a first patterned circuit arranged on the side wall; a plurality of vias disposed in the tank body for electrically connecting at least one of the patterned electrodes to the first patterned circuit; an oscillating chip arranged on the inner surface and located in the recess; and a plurality of connecting wires located in the recess and respectively connected to the oscillating chip and the first patterned circuit in a wire bonding manner; wherein the micro crystal oscillator is of millimeter level.