Micro Device Transfer via Liquid Capillary Gripping
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Solution Overview
Problem
Traditional methods for transferring micro devices from a carrier substrate to a receiving substrate, such as direct and indirect bonding, are complex and involve multiple steps, which can be inefficient and prone to errors.
Innovation Solution
A method involving a carrier substrate with an adhesive layer, a transfer head to pick up the micro device, and a receiving substrate with a liquid layer that grips the micro device via capillary force, allowing the micro device to be detached from the transfer head and adhered to the receiving substrate, simplifying the transfer process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If direct bonding is used to transfer micro devices from carrier substrate to receiving substrate, then the transfer process can be completed in one bonding step, but the process requires high precision and is prone to errors
Solution Approach 1:
The patent introduces an intermediary liquid layer between the micro device and the receiving substrate. This liquid layer acts as a mediator that enables reliable attachment through capillary forces while allowing for error correction during the transfer process, thus resolving the contradiction between transfer efficiency and transfer accuracy
2Reliability
If indirect bonding is used to transfer micro devices, then the transfer process involves two bonding/de-bonding steps which improves accuracy, but the process complexity increases
Solution Approach 1:
The patent combines the bonding and de-bonding operations into a single integrated process using the liquid layer. The liquid layer simultaneously enables attachment of the micro device to the receiving substrate and facilitates its release from the carrier substrate, thus reducing process complexity while maintaining transfer accuracy
3Reliability
If traditional bonding methods are used, then equipment and process steps are complex, but the transfer process can be completed
Solution Approach 1:
The patent replaces complex mechanical bonding systems with a liquid-based capillary force system. Instead of using sophisticated mechanical alignment and bonding equipment, the invention uses the natural capillary action of a liquid layer to achieve precise and reliable micro device transfer, thus reducing equipment complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the transfer process by leveraging capillary forces to securely attach micro devices to the receiving substrate, reducing the need for complex equipment and steps, and ensuring accurate placement and adhesion.
Implementation Method 1
placing the micro device over the receiving substrate by the transfer head such that the micro device is in contact with the liquid layer and is gripped by a capillary force
Data Source
AI summary
A method for transferring a micro device is provided. The method includes: preparing a carrier substrate with the micro device thereon, wherein an adhesive layer is between and in contact with the carrier substrate and the micro device; picking up the micro-device from the carrier substrate by a transfer head; forming a liquid layer on a receiving substrate; and placing the micro device over the receiving substrate by the transfer head such that the micro device is in contact with the liquid layer and is gripped by a capillary force; and moving the transfer head away from the receiving substrate such that the micro device is detached from the transfer head and is stuck to the receiving substrate.