Micro Device Encapsulation with Redundant Sealing Grooves
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Solution Overview
Problem
The packaging of micro devices, such as integrated circuits and micro electro-mechanical structures, faces challenges in ensuring reliability and yield due to contamination from dust and pollutants in ambient environments, and existing packaging methods do not adequately protect these devices during testing and handling.
Innovation Solution
An encapsulation cover with grooves on its lower surface forms air-tight closed-loop interfaces with the substrate, creating a redundant sealing system that maintains a vacuum environment around the micro device, enhancing reliability and allowing for transparent access to electrical and optical signals for testing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single sealing interface is used between the encapsulation cover and substrate, then the packaging structure is simple, but the reliability of the vacuum environment is insufficient
Solution Approach 1:
The sealing interface is divided into multiple separate closed-loop interfaces (first, second, third, and fourth closed-loop interfaces) around the micro device. Each interface forms an independent sealing loop, so that if one interface fails, the other interfaces continue to maintain the vacuum environment, thereby improving reliability without requiring a completely complex new structure.
Solution Approach 2:
The patent incorporates redundant sealing interfaces as a preventive measure against potential sealing failures. By providing multiple sealing paths before any failure occurs, the system ensures that the vacuum environment is protected even if one sealing interface deteriorates or fails during operation.
2Object-affected harmful factors
If the encapsulation cover completely seals the micro device, then contamination is prevented, but access to electrical and optical signals for testing becomes difficult
Solution Approach 1:
The encapsulation cover is designed with segmented openings that allow electrical and optical signals to pass through while maintaining the vacuum seal. The closed-loop interfaces are positioned to seal around the micro device while leaving designated paths open for signal transmission, enabling both protection and accessibility.
Solution Approach 2:
The patent uses intermediary structures (such as feedthroughs or waveguides) that allow electrical and optical signals to penetrate the encapsulation barrier. These intermediaries maintain the vacuum seal while providing controlled access points for testing and operation.
3Reliability
If multiple closed-loop interfaces are formed, then redundant sealing is achieved, but the manufacturing precision requirements increase
Solution Approach 1:
The patent integrates multiple closed-loop interfaces into a unified encapsulation structure where the interfaces work together as a system. The interfaces are combined in a way that they collectively provide redundancy while sharing common manufacturing features and alignment references, reducing the overall precision burden compared to completely separate sealing structures.
Solution Approach 2:
The design allows for parameter variations in the closed-loop interfaces (such as different sizes, shapes, or positions) to optimize both redundancy and manufacturability. By adjusting geometric parameters, the system achieves adequate sealing redundancy while maintaining reasonable manufacturing precision requirements for each individual interface.
Data Source
AI summary
A packaged die includes a substrate having an upper surface and a micro device on the upper surface and an encapsulation cover comprising one or more grooves on its lower surface. The lower surface of the encapsulation cover and the upper surface of the substrate are bonded together to form a plurality of air-tight closed-loop interfaces and encapsulate the micro device.