Micro Device Panel Transfer With Localized Rolling Heat Bonding
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Solution Overview
Problem
The existing micro device transfer and bonding processes in micro light-emitting diode displays face challenges with slower processing steps acting as bottlenecks, affecting overall throughput and potentially damaging non-bonding regions due to whole-surface heating methods.
Innovation Solution
A micro device mass transfer equipment and method that separates the transfer and bonding processes, using a laser lift-off technique, rolling and pressing mechanism, and staged heating to improve alignment and bonding yield, while preventing damage from unexpected heat flows.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If whole-surface heating method is used for bonding, then bonding process can be completed, but non-bonding region (already-bonded region) is damaged due to unexpected heat flow
Solution Approach 1:
The patent implements localized heating by positioning the heating mechanism to heat only the contact region between the moving stage and rolling and pressing mechanism, rather than heating the entire substrate surface. This localized approach ensures that already-bonded regions are not exposed to unnecessary heat, preventing damage to non-bonding regions while maintaining effective bonding in the contact region.
Solution Approach 2:
The bonding process is segmented into distinct stages: transfer stage and bonding stage. The heating mechanism operates only during the bonding stage in the contact region, separating the heating function from the overall process. This segmentation allows precise control of heat application timing and location, avoiding damage to regions that have already been bonded.
2Manufacturing precision
If transfer process and bonding process are performed separately, then alignment accuracy and bonding yield are improved, but process time increases due to separate processing steps
Solution Approach 1:
The patent merges the transfer process and bonding process into a single continuous operation on the moving stage. The laser lift-off technique transfers micro devices to the target substrate, and the rolling and pressing mechanism simultaneously performs bonding in the contact region. This integration maintains high alignment accuracy while reducing total process time compared to completely separate processes.
Solution Approach 2:
The moving stage enables continuous movement through the laser device and rolling and pressing mechanism, maintaining continuous useful action throughout the transfer and bonding process. The staged heating and continuous motion eliminate idle time between transfer and bonding operations, improving throughput while preserving alignment precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances transfer accuracy and bonding yield by separating transfer and bonding stages, ensuring precise alignment and stable electrical connections without damaging already-bonded micro devices.
Implementation Method 1
the at least one micro device on the at least one micro device substrate is irradiated using a laser device, such that the at least one micro device is detached from the at least one micro device substrate and transferred to the target substrate
Implementation Method 2
The heating mechanism is disposed corresponding to the contact region, and is adapted to heat the contact region between the moving stage and the rolling and pressing mechanism
Data Source
AI summary
A micro device mass transfer equipment including a base stage, a moving stage, a substrate stage, a laser device, a rolling and pressing mechanism, and a heating mechanism is provided. The moving stage is movably disposed on the base stage, and moves with a moving path. The substrate stage is movably disposed on the base stage, and is adapted to move between different positions overlapping the moving stage. The laser device is movably disposed on the base stage. The laser device is adapted to move relative to the substrate stage, and emits a laser beam toward the substrate stage. The rolling and pressing mechanism is disposed on the moving path of the moving stage, and forms a contact region with the moving stage. The heating mechanism is disposed corresponding to the contact region, and is adapted to heat the contact region between the moving stage and the rolling and pressing mechanism.