Micro-device Packaging Bonding Layer for Optical MEMS
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Solution Overview
Problem
The existing silicon oxide to silicon oxide bond in optical MEMS packages may not be strong enough for some applications, necessitating an enhancement in the cover-to-membrane bond strength while maintaining optical clarity.
Innovation Solution
A two-part bonding layer is introduced, comprising a transparent silicon oxide inner part for optical clarity and a stronger opaque silicon outer part, which provides increased bond strength without compromising light transmission, using techniques such as chemical-mechanical polishing and plasma treatment for activation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a silicon oxide to silicon oxide bond is used to attach the glass cover to the MEMS device, then optical clarity is maintained, but bond strength is insufficient for some applications
Solution Approach 1:
The bonding layer is segmented into two distinct parts: an inner transparent bonding layer (silicon oxide) that maintains optical clarity, and an outer opaque bonding layer (silicon) that provides enhanced bond strength. This segmentation allows each part to fulfill its specific function without compromising the other.
Solution Approach 2:
Different regions of the bonding structure are assigned different material properties: the inner region uses transparent silicon oxide for optical clarity where light passes through, while the outer region uses opaque silicon for maximum bond strength where structural support is needed but light transmission is not required.
2Strength
If a stronger opaque bonding material is used to increase bond strength, then bond strength is improved, but optical clarity is compromised
Solution Approach 1:
The bonding structure is divided into inner and outer bonding layers with different material compositions. The inner layer uses transparent material for optical clarity, while the outer layer uses opaque material for strength, allowing both requirements to be satisfied simultaneously in different spatial zones.
Solution Approach 2:
The bonding structure employs a composite configuration combining transparent silicon oxide material and opaque silicon material in a layered arrangement. This composite structure integrates the advantageous properties of both materials: transparency where needed and strength where needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly enhances the bond strength between the cover and the membrane, ensuring reliable performance in optical MEMS devices while maintaining optical clarity and structural integrity.
Implementation Method 1
a thermally grown or deposited silicon oxide layer on the bottom of the glass cover bonds to a thermally grown or deposited silicon oxide membrane
Implementation Method 2
a thermally grown or deposited silicon oxide layer on the bottom of the glass cover bonds to a thermally grown or deposited silicon oxide membrane
Implementation Method 3
using techniques such as chemical-mechanical polishing and plasma treatment for activation
Implementation Method 4
using techniques such as chemical-mechanical polishing and plasma treatment for activation
Data Source
AI summary
In one embodiment, a package for a micro-device includes a substrate, a transparent material covering the substrate, and a bond ring bonding the transparent material to the substrate. The bond ring comprises a silicon oxide layer on one of the substrate or the transparent material bonded to a silicon layer on the other of the substrate or the transparent material.