Micro-device Panel Manufacturing via Segmented Block Transfer

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Solution Overview

Problem

The manufacturing process of micro-LED displays is inefficient due to long production times and low yield rates, as the transfer of micro-devices onto a substrate is time-consuming and prone to errors, with most of the time spent on alignment and a high probability of defects leading to discarded panels.

Innovation Solution

A manufacturing process involving the formation of micro-device sets on a transferring substrate, which are then transferred onto receiving blocks to form building blocks, tested for functionality, and connected to create a micro-device panel, reducing alignment time and increasing accuracy, and ensuring only functional blocks are used, thereby enhancing yield rates.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If micro-device sets are transferred onto a large active area substrate, then the panel can be manufactured, but most time is wasted on moving and aligning the transferring unit, resulting in long manufacturing time

Engineering Contradiction:
Improvemanufacturing efficiencyVSAvoidalignment time
Core Design Contradiction:
ProductivityVSLoss of time

Solution Approach 1:

The patent divides the large active area substrate into multiple smaller receiving blocks arranged in an array. Each transferring unit is transferred to a corresponding receiving block rather than the entire active area at once. This segmentation reduces the alignment distance and time for each transfer operation, thereby improving manufacturing efficiency while minimizing time loss.

Inventive Principle:
Principle #1Segmentation

2Productivity

If multiple micro-device sets are placed onto the active area at once, then production speed increases, but the probability of defects increases, leading to discarded panels

Engineering Contradiction:
Improveproduction speedVSAvoidyield rate
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent segments the transfer process into multiple independent operations, where each transferring unit is placed on a corresponding receiving block separately. This allows for individual verification and reduces the risk that a defect in one unit compromises the entire panel, thereby maintaining production speed while improving yield rate.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent implements a verification mechanism where each transferred micro-device set is checked for defects before proceeding to the next step. This feedback loop enables early detection of defects, allowing for corrective actions without discarding the entire panel, thus improving reliability while maintaining productivity.

Inventive Principle:
Principle #23Feedback

3Reliability

If the entire panel is detected to have a defect, then quality control is maintained, but the entire panel must be discarded, resulting in low yield rate

Engineering Contradiction:
Improvequality controlVSAvoidyield rate
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent divides the panel into multiple receiving blocks that can be independently transferred and verified. If a defect is detected in one block, only that specific block needs to be replaced or repaired rather than discarding the entire panel. This segmentation maintains quality control while significantly improving yield rate by preventing total panel loss from localized defects.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS10615136B2Micro-device panel and manufacturing process thereof
Publication Date: 2020.04.07 NOVATEK MICROELECTRONICS CORP
  • US10615136B2 patent drawing
  • US10615136B2 patent drawing
  • US10615136B2 patent drawing

AI summary

A manufacturing process for a micro-device panel including the following steps is provided. A plurality of micro-device sets are formed on a transferring substrate, and each of the plurality of micro-device sets has at least one micro-device. A plurality of receiving blocks are provided. The plurality of micro-device sets are respectively transferred from the transferring substrate onto the plurality of receiving blocks to form a plurality of building blocks by a transfer head. The plurality of building blocks are placed on a receiving substrate. Finally, the adjacent building blocks on the receiving substrate are connected by a plurality of connecting devices to form the micro-device panel.