Micro Device Transfer via Cooled Liquid Layer Binding
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Solution Overview
Problem
Current methods for transferring micro devices, such as wafer bonding, face challenges in achieving cost reduction, time efficiency, and yield, especially when handling large quantities like millions of devices.
Innovation Solution
A method involving a transfer head that forms a liquid layer between a micro device and a substrate, with both the transfer head and substrate maintained at temperatures lower than the environmental temperature, allowing the micro device to be bound to the substrate through the liquid layer, which is then evaporated to secure the device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional wafer bonding methods are used for transferring micro devices, then device transfer can be achieved, but cost reduction and time efficiency are compromised
Solution Approach 1:
The patent utilizes phase transition of liquid from liquid state to vapor state through controlled evaporation. A liquid layer is formed between the transfer head and substrate, then evaporated to create strong capillary forces for binding micro devices, enabling rapid and efficient transfer
Solution Approach 2:
The patent changes temperature parameters by maintaining the transfer head and substrate at temperatures lower than environmental temperature. This temperature control prevents premature evaporation of the liquid layer during binding, ensuring strong adhesion forces
2Strength
If liquid layer binding is used to transfer micro devices, then binding strength is improved, but evaporation of liquid layer during binding reduces effectiveness
Solution Approach 1:
The patent changes temperature parameters by maintaining the transfer head and substrate at temperatures lower than environmental temperature. This temperature control prevents premature evaporation of the liquid layer during binding, ensuring strong adhesion forces
Solution Approach 2:
The patent performs preliminary cooling of the transfer head and substrate before forming the liquid layer. This preliminary action ensures that the components are ready to receive and bind the liquid layer without immediate evaporation, maintaining binding effectiveness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively reduces evaporation of the liquid layer during binding, ensuring strong capillary forces secure the micro device to the substrate, improving handling efficiency and reducing costs and time, while maintaining high yield.
Implementation Method 1
binding the micro device to the substrate by the liquid layer
Implementation Method 2
The liquid layer is then evaporated to secure the device
Implementation Method 3
maintaining a first temperature of the transfer head to be lower than an environmental temperature; maintaining a second temperature of the substrate to be lower than the environmental temperature
Data Source
AI summary
A method of handling a micro device is provided. The method includes: holding the micro device by a transfer head; forming a liquid layer between the micro device and a substrate; maintaining a first temperature of the transfer head to be lower than an environmental temperature; maintaining a second temperature of the substrate to be lower than the environmental temperature; and binding the micro device to the substrate by the liquid layer.