Micro-device Transfer Machine Cushion Layer Impact Protection
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Solution Overview
Problem
Traditional micro-device transfer processes often result in damage due to impact forces and misalignment issues between the transfer head and micro-devices, leading to ineffective grip forces and potential damage to both the transfer head and micro-devices.
Innovation Solution
A machine with a carrier and transfer device configuration that includes a pedestal, substrate, and cushion layers between the transfer head holder and transfer head, or between the pedestal and substrate, allowing for deformation to absorb impact forces and calibrate surfaces for improved grip and protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the transfer head is moved to grip the micro-device, then the transfer operation can be performed, but impact force may damage the transfer head and micro-device
Solution Approach 1:
The patent introduces a cushion layer between the transfer head holder and the transfer head, or between the pedestal and substrate. This cushion layer is positioned in advance to absorb impact forces that occur during the transfer operation, preventing damage to both the transfer head and micro-device while maintaining operational productivity.
2Ease of operation
If the transfer head and micro-device are arranged imperfectly, then misalignment occurs, but the transfer head may produce impact force causing damage
Solution Approach 1:
The cushion layer is pre-positioned in the transfer system to compensate for potential misalignment between the transfer head and micro-device. When misalignment occurs during operation, the cushion layer absorbs the resulting impact forces, allowing flexible arrangement while preventing damage.
Solution Approach 2:
The cushion layer acts as an intermediary element between the transfer head and the micro-device/substrate system. This intermediate layer mediates the interaction by absorbing impact forces that arise from misalignment, protecting both the transfer head and micro-device while maintaining operational flexibility.
3Object-affected harmful factors
If the cushion layer is added to absorb impact force, then damage is reduced, but the device complexity increases
Solution Approach 1:
The cushion layer is integrated into the existing transfer device structure as a protective element positioned between the transfer head holder and transfer head, or between the pedestal and substrate. This addition provides impact absorption capability while maintaining relatively simple device architecture.
Solution Approach 2:
The cushion layer serves as an intermediary component that can be added to the transfer system without fundamentally redesigning the entire device. By positioning this intermediate element strategically, impact force absorption is achieved with minimal increase in overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The cushion layers effectively absorb impact forces, reduce damage to micro-devices and transfer heads, maintain grip forces by eliminating gaps, and can withstand high temperatures, ensuring reliable and safe micro-device transfer.
Implementation Method 1
The cushion layer is configured to deform to absorb the impact force
Implementation Method 2
The cushion layer is configured to withstand high temperatures
Data Source
AI summary
A machine for transferring at least one micro-device includes a carrier and a transfer device. The carrier includes a pedestal, a substrate, and at least one first cushion layer. The substrate allows the micro-device to be temporarily disposed thereon. The first cushion layer is disposed between the pedestal and the substrate. The transfer device includes a transfer head holder, transfer head, and at least one second cushion layer. The transfer head holder moves at least along a z-axis substantially perpendicular to the substrate. The transfer head has a grip force on the micro-device. The second cushion layer is disposed between the transfer head holder and the transfer head.