Micro Device Transfer Head Hexagonal Picking
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Solution Overview
Problem
Current methods for transferring micro devices, such as wafer bonding, face challenges in achieving cost reduction, time efficiency, and high yield, especially when dealing with large-scale transfers of millions of devices.
Innovation Solution
The method involves arranging micro devices on a carrier substrate in a hexagonal pattern and using a transfer head with pick-up portions arranged in a rectangular manner to efficiently pick up and transfer the devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional wafer bonding methods are used for transferring micro devices, then the transfer process can be completed, but the cost is high and the time consumption is large
Solution Approach 1:
The invention segments the transfer process into two distinct stages: first bonding multiple micro devices simultaneously to a transfer substrate, then transferring them as a group to the target substrate. This segmentation enables batch processing rather than individual device transfer, significantly improving productivity and reducing time consumption for large-scale transfers
Solution Approach 2:
The invention performs preliminary bonding of multiple micro devices to a transfer substrate before the actual transfer to the target substrate. This preliminary arrangement allows for optimized positioning and grouping of devices, enabling efficient batch transfer operations that reduce overall transfer time and improve productivity
2Quantity of substance
If traditional rectangular arrangement is used on carrier substrate, then the transfer head can easily pick up devices, but the quantity of devices per substrate is limited
Solution Approach 1:
The invention transitions from traditional rectangular (2D grid) arrangement to hexagonal (honeycomb) packing arrangement on the carrier substrate. This dimensional reorganization of the lattice structure increases the number of devices that can be packed on the same substrate area by approximately 15%, maximizing the quantity of devices without complicating the pick-up operation
Solution Approach 2:
The invention employs asymmetric hexagonal packing patterns that optimize space utilization compared to symmetric rectangular arrangements. The hexagonal lattice provides more efficient space filling, allowing more devices to be positioned on the carrier substrate while maintaining accessibility for the transfer head to pick up devices in a systematic manner
Data Source
AI summary
A method of transferring a plurality of micro devices is provided. The method includes: arranging the micro devices on a carrier substrate in a hexagonal manner; arranging a plurality of pick-up portions of a transfer head in a rectangular manner; and picking up the micro devices from the carrier substrate by the pick-up portions.