Micro Device Transfer via Light-Activated Adhesiveness-Loss Layer
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Solution Overview
Problem
Conventional mass transferring methods for micro-LED devices require multiple transfer heads for precise alignment and picking up, which is costly and difficult to align, especially as micro-device spacings vary.
Innovation Solution
A micro device transferring method using a carrier substrate with a light radiation activated adhesiveness-loss layer, where specific areas are irradiated to reduce adhesiveness, allowing for accurate picking up and transfer of micro devices using a vacuum absorbing device, eliminating the need for multiple transfer heads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple transfer heads are used for picking up micro devices, then the picking up capability is improved, but the device complexity and alignment difficulty increase
Solution Approach 1:
The adhesiveness-loss layer is divided into multiple independent light-transmitting regions corresponding to different micro device positions. By selectively irradiating specific regions, individual micro devices can be picked up independently using a single transfer head, eliminating the need for multiple transfer heads while maintaining high productivity
Solution Approach 2:
The adhesiveness-loss layer has different properties in different regions - some regions are irradiated to lose adhesiveness for picking up, while other regions retain adhesiveness for holding. This local differentiation allows a single transfer head to selectively pick up specific micro devices without affecting others
2Productivity
If multiple transfer heads are used for picking up micro devices, then the picking up capability is improved, but the alignment precision becomes more difficult to achieve
Solution Approach 1:
The adhesiveness-loss layer is segmented into multiple light-transmitting regions, each corresponding to a specific micro device position. This segmentation allows precise control of which micro devices are picked up by irradiating specific regions, simplifying alignment requirements compared to coordinating multiple transfer heads
Solution Approach 2:
The light-transmitting regions in the adhesiveness-loss layer serve as an intermediary that defines the picking up positions. Instead of aligning multiple transfer heads directly with micro devices, the system aligns the irradiation pattern with the pre-defined light-transmitting regions, which simplifies the alignment process while maintaining precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the transfer process, reduces alignment difficulties, and lowers costs by enabling one-to-many picking up of micro devices with different spacings, optimizing the mass transfer of micro devices.
Implementation Method 1
a light radiation activated adhesiveness-loss layer disposed on a first surface of the transparent base
Implementation Method 2
picking up the micro devices located in the plurality of target areas
Data Source
AI summary
A micro device transferring method and a micro device transferring apparatus are provided. The micro device transferring method exemplarily includes: providing a carrier substrate including a transparent base, a light radiation activated adhesiveness-loss layer located on a first surface of the transparent base and multiple micro devices arranged in an array on the light radiation activated adhesiveness-loss layer; locally irradiating the light radiation activated adhesiveness-loss layer from a second surface of the transparent base to reduce adhesiveness of multiple target areas of the light radiation activated adhesiveness-loss layer to the micro devices respectively located in the multiple target areas, the multiple target areas being areas corresponding to the micro devices to be transferred; picking up the micro devices in the multiple target areas; and aligning the picked up micro devices with corresponding locations of a receiving substrate, and releasing them onto the receiving substrate.