Micro-Element Defect Removal With In-Line Image Verification
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Solution Overview
Problem
The existing process of detecting and removing defective microelectronic elements requires multiple apparatus transfers, increasing working hours and hindering mass production efficiency in manufacturing processes like micro-LED displays.
Innovation Solution
A defect detection and removal apparatus integrates a removing unit, image capturing unit, and determining unit to capture and confirm the successful removal of defective micro-elements on a substrate without the need for additional apparatus transfers, using a laser beam to separate defective elements and comparing pre- and post-removal images for confirmation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If separate detection and removal apparatus are used, then detection precision and removal function are specialized, but working hours increase due to multiple apparatus transfers
Solution Approach 1:
The patent combines the detection apparatus and removal apparatus into a single integrated system. The detection unit captures images of micro-elements on the substrate, the determining unit identifies defective elements, and the removing unit eliminates them, all within one apparatus. This integration eliminates the need to transfer the substrate between separate detection and removal apparatus, thereby reducing working hours while maintaining specialized functions for both detection and removal operations.
2Adaptability or versatility
If multiple apparatus transfers are performed, then specialized detection and removal functions are maintained, but production efficiency decreases
Solution Approach 1:
The patent integrates multiple specialized functions (detection, determination, and removal) into a single apparatus that can perform all operations on the substrate without transfer. The detection unit specializes in capturing images, the determining unit specializes in identifying defects, and the removing unit specializes in eliminating defective elements, maintaining functional specialization while improving productivity by eliminating transfer steps.
Solution Approach 2:
The integrated apparatus serves multiple functions within a single system: the detection unit performs imaging, the determining unit performs defect analysis, and the removing unit performs elimination of defective elements. This multi-functional design allows the apparatus to handle the complete workflow from detection to removal without requiring separate specialized apparatus, thereby enhancing production efficiency.
3Reliability
If substrate is moved between apparatuses for verification, then removal accuracy can be confirmed, but working hours increase
Solution Approach 1:
The patent implements a feedback mechanism where the detection unit captures images before removal, the removing unit eliminates defective elements, and then the detection unit captures images again to verify successful removal. The determining unit compares the before and after images to confirm whether the defective element has been successfully removed. This closed-loop feedback system ensures removal accuracy is confirmed without requiring transfer to another apparatus, as verification is performed by the same integrated system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This integrated approach reduces working hours by allowing in-line inspection and removal within a single apparatus, enhancing production efficiency.
Implementation Method 1
The image capturing unit is configured to capture a detection image of at least one defective micro-element correspondingly on the substrate
Implementation Method 2
using a laser beam to separate defective elements
Data Source
AI summary
A defect detection and removal apparatus including a removing unit, an image capturing unit, and a determining unit is provided. The removing unit is configured to remove at least one defective micro-element on a substrate. The image capturing unit is configured to capture a detection image of at least one defective micro-element correspondingly on the substrate. The determining unit is coupled to the image capturing unit and the removing unit. The image capturing unit executes capturing a first detection image before the removing unit executes removing a defective micro-element, and executes capturing a second detection image after the removing unit executes removing the defective micro-element. The determining unit confirms whether the defective micro-element has been removed according to the first and second detection image obtained from the image capturing unit. A defect detection and removal method is also provided.


