Micro Electronic Element Trimming With Dual-Pulse Laser Detachment
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for removing poor-quality micro electronic elements from substrates, such as micro LEDs, are inefficient and can cause significant damage to the substrate and conductive circuits due to high energy requirements and improper removal techniques like laser breaking or desoldering.
Innovation Solution
A dual-pulse laser trimming method using a first pulse to reduce bonding force and a second pulse to generate a shock wave, minimizing substrate damage and efficiently removing the elements by reducing the energy required.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a laser is used to break the micro light-emitting diode for removal, then the micro light-emitting diode can be removed from the substrate, but the energy required is large which damages the conductive circuit of the display backplane
Solution Approach 1:
The removal process is divided into two distinct laser steps: first heating the bonding interface to reduce bonding force, then generating a shock wave to detach the element. This segmentation allows each laser pulse to be optimized for its specific function, reducing overall energy requirements and substrate damage.
Solution Approach 2:
The first laser pulse performs preliminary heating of the bonding interface before the actual removal action. This preliminary action reduces the bonding force between the micro light-emitting diode and substrate, so that the second pulse can remove the element with less energy, minimizing substrate damage.
2Ease of manufacture
If traditional removal methods like desoldering or laser breaking are used, then micro light-emitting diodes can be removed, but the working hours are long and efficiency is low
Solution Approach 1:
The patent replaces traditional mechanical removal methods (desoldering, manual extraction) with a dual-pulse laser system that uses thermal and shock wave effects. This substitution dramatically reduces removal time and increases productivity while maintaining effectiveness.
Solution Approach 2:
The removal process uses two periodic laser pulses with specific timing: the first pulse heats the interface, and the second pulse generates a shock wave. This periodic action sequence achieves rapid removal compared to continuous traditional methods, improving productivity.
3Ease of manufacture
If high energy is used to break the micro light-emitting diode, then the element can be removed from the substrate, but the conductive circuit of the display backplane is damaged
Solution Approach 1:
The laser energy is concentrated locally at the bonding interface and surface layer of the micro light-emitting diode, rather than being distributed throughout the entire structure. This localized heating and shock wave generation enables removal while preserving the integrity of the conductive circuit on the substrate.
Solution Approach 2:
The patent introduces plasma as an intermediary mechanism. The second laser pulse generates plasma on the surface layer, which then produces a shock wave that detaches the element. This intermediary process transfers energy efficiently for removal while limiting direct laser exposure to the substrate circuit.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves high efficiency in removing micro electronic elements with reduced substrate damage and lower energy consumption, shortening the working hours and preserving the integrity of the substrate and conductive circuits.
Implementation Method 1
An interface of the substrate and the micro electronic element is heated by a first pulse laser beam to reduce a bonding force between the micro electronic element and the substrate
Implementation Method 2
A surface layer of the micro electronic element is irradiated by a second pulse laser beam to generate a shock wave due to plasma on the surface layer of the micro electronic element
Implementation Method 3
A surface layer of the micro electronic element is irradiated by a second pulse laser beam to generate a shock wave due to plasma on the surface layer of the micro electronic element
Data Source
AI summary
A method for trimming a micro electronic element includes: providing a substrate, wherein at least one micro electronic element is disposed on the substrate, heating an interface of the substrate and the micro electronic element by a first pulse laser beam to reduce a bonding force between the micro electronic element and the substrate, and irradiating a surface layer of the micro electronic element by a second pulse laser beam to generate a shock wave due to plasma on the surface layer of the micro electronic element. The shock wave removes the micro electronic element away from the substrate. An apparatus for trimming a micro electronic element is also provided.