Micro Electronic Element Release Using Dual-Pulse Laser Shock Waves
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Solution Overview
Problem
Existing methods for removing micro electronic elements from substrates, such as micro LEDs, are inefficient and can cause significant damage to the substrate and conductive circuits due to high energy requirements and improper removal techniques.
Innovation Solution
A dual-pulse laser system is employed to reduce the bonding force between the micro electronic elements and the substrate using a first pulse laser beam, followed by generating a shock wave with a second pulse laser beam to detach the elements, minimizing substrate damage and energy usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a laser is used to break the micro light-emitting diode for removal, then the micro light-emitting diode can be removed from the substrate, but the energy required is large which damages the conductive circuit of the display backplane
Solution Approach 1:
The removal process is divided into two distinct laser steps: first heating the interface to reduce bonding force, then generating shock wave to detach the element. This segmentation allows each laser pulse to be optimized for its specific function, reducing overall energy requirement and substrate damage.
Solution Approach 2:
The first laser pulse performs preliminary heating of the interface before the second pulse generates the shock wave. This preliminary action weakens the bonding force in advance, so that less energy is needed for actual detachment, reducing damage to the substrate.
2Ease of manufacture
If traditional removal methods are used for micro electronic elements, then removal can be achieved, but the efficiency is not high and processing time is long
Solution Approach 1:
Traditional mechanical removal methods (manual picking, suction pens) are replaced with a laser-based system that uses optical energy to heat and generate shock waves. This substitution dramatically increases removal speed and efficiency while maintaining precision.
Solution Approach 2:
The laser removal process uses periodic pulsed action with two distinct pulses: the first pulse heats the interface, and the second pulse generates the shock wave for detachment. This periodic action is much faster and more efficient than continuous mechanical removal methods.
3Ease of manufacture
If high energy laser is used to break micro electronic elements, then removal can be achieved, but the conductive circuit of the display backplane is damaged
Solution Approach 1:
The laser energy is concentrated locally at the interface between the micro light-emitting diode and the substrate, rather than applying high energy across the entire substrate. This localized heating and shock wave generation removes the element while preserving the integrity of surrounding conductive circuits.
Solution Approach 2:
The interface layer between the micro light-emitting diode and substrate acts as an intermediary that absorbs and concentrates the laser energy. By targeting this intermediate layer, the removal process protects the conductive circuits on the substrate from direct laser damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method achieves high efficiency in removing micro electronic elements while reducing substrate damage and shortening processing time, with lower laser energy consumption.
Implementation Method 1
An interface of the substrate and the micro electronic element is heated by a first pulse laser beam to reduce a bonding force between the micro electronic element and the substrate
Implementation Method 2
A surface layer of the micro electronic element is irradiated by a second pulse laser beam to generate a shock wave due to plasma on the surface layer of the micro electronic element
Implementation Method 3
A surface layer of the micro electronic element is irradiated by a second pulse laser beam to generate a shock wave due to plasma on the surface layer of the micro electronic element
Data Source
AI summary
A method for manufacturing a micro electronic element includes: providing a substrate, wherein at least one micro electronic element is disposed on the substrate, heating an interface of the substrate and the micro electronic element by a first pulse laser beam to reduce a bonding force between the micro electronic element and the substrate, and irradiating a surface layer of the micro electronic element by a second pulse laser beam to generate a shock wave due to plasma on the surface layer of the micro electronic element. The shock wave removes the micro electronic element away from the substrate. An apparatus for manufacturing a micro electronic element is also provided.