Wafer-Level Micro-Element Package with Grooved Transparent Cover
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Solution Overview
Problem
Current image sensor module manufacturing methods, such as Chip On Board (COB), face challenges in reducing module height, increasing manufacturing costs, and deteriorating productivity due to particle contamination, which limits miniaturization and thinness.
Innovation Solution
A micro-element package is created using a substrate with a micro-element and a transparent cover having a groove, where the cover is attached to the substrate, selectively thinned to expose the groove, and the substrate is diced along the groove, forming a sealed air cavity and allowing for miniaturization and reduced height, while preventing contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If COB method is used to attach PCB on image sensor chip, then mass production is facilitated, but module height cannot be reduced below a certain value
Solution Approach 1:
The invention segments the packaging process into two distinct stages: first, attaching the transparent cover to the chip in a wafer-level process; second, dicing the substrate along grooves to separate individual packages. This segmentation enables height reduction while maintaining manufacturing efficiency.
Solution Approach 2:
The invention introduces a vertical groove structure in the transparent cover, creating a new dimensional approach to packaging. The groove allows the substrate to be diced into thin sections, reducing module height while maintaining structural integrity and electrical connections.
2Productivity
If individual chip packaging is performed, then each chip is protected, but productivity deteriorates and manufacturing costs increase
Solution Approach 1:
The invention merges multiple chips into a wafer-level assembly, attaching a single transparent cover to protect multiple chips simultaneously. This combining approach increases productivity by processing multiple units in one operation while maintaining individual chip protection through the continuous cover structure.
Solution Approach 2:
The transparent cover is attached to the entire wafer before dicing, performing the protection function in advance. This preliminary action ensures all chips are protected during subsequent handling and assembly operations, improving both productivity and reliability.
3Reliability
If conventional packaging is used, then chips are assembled, but particle contamination occurs during manufacturing
Solution Approach 1:
The transparent cover is attached to seal the chips before any subsequent assembly operations. This preliminary sealing action prevents particle contamination during dicing, handling, and PCB assembly, thereby improving yield by eliminating contamination-related failures.
Solution Approach 2:
The transparent cover acts as an intermediary barrier between the chips and the external environment. It mediates protection against particle contamination while allowing optical signals to pass through, maintaining both reliability and optical functionality.
4Productivity
If wafer-level packaging is implemented, then mass production efficiency increases, but manufacturing precision requirements increase
Solution Approach 1:
The invention applies local quality by creating grooves only in specific locations of the transparent cover where dicing is required. This localized feature simplifies the overall manufacturing precision requirements, as the groove structure provides natural alignment references for the dicing process.
Data Source
AI summary
A method of manufacturing a micro-element package which can reduce a manufacturing cost and improve productivity by simplifying its structure and manufacturing process, and also can make contributions to miniaturization and thinness, and the micro-element package are provided. The method of the micro-element package including: providing a substrate having a micro-element on its top surface and a transparent cover having a groove on its bottom surface; attaching the transparent cover on the substrate, wherein the bottom surface of the transparent cover where the groove is formed faces the micro-element; exposing the groove by selectively eliminating the transparent cover; and dicing the substrate along the exposed groove.