Micro Flow Channel Chip Adhesive Bonding Shape Accuracy
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Solution Overview
Problem
The existing methods for producing micro flow channel chips face challenges in achieving high shape accuracy and efficiency due to thermal fusion during the joining process, leading to deflection of the cover member's film and reduced precision in the flow channel structure.
Innovation Solution
A method involving the formation of a groove on a base material, followed by lamination with an adhesive resin layer having a glass transition temperature of 25° C. or lower, which covers the groove and bonds with a resin film, allowing for bonding without high-temperature heat pressing, thereby enhancing shape accuracy and production efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If thermal fusion is used to join the substrate and cover member, then bonding strength is improved, but shape accuracy deteriorates due to film deflection
Solution Approach 1:
The invention changes the bonding mechanism from thermal fusion to adhesive bonding using a pressure-sensitive adhesive layer. This parameter change allows bonding without high-temperature heat pressing, thereby preventing film deflection and maintaining shape accuracy while still achieving sufficient bonding strength between the substrate and cover member
Solution Approach 2:
The invention replaces the thermal field (heat-based thermal fusion) with a chemical field (adhesive bonding). The pressure-sensitive adhesive layer forms chemical bonds between surfaces without requiring high temperature, thus avoiding the thermal deformation that causes film deflection while maintaining bonding strength
2Strength
If thermal fusion with high-temperature heat pressing is used, then bonding strength is improved, but production efficiency deteriorates
Solution Approach 1:
The invention changes the bonding temperature parameter from high-temperature thermal fusion to room-temperature or low-temperature adhesive bonding. This eliminates the need for prolonged heat pressing cycles, significantly reducing production time and improving manufacturing efficiency while maintaining adequate bonding strength
Solution Approach 2:
The invention substitutes the thermal processing step with a chemical adhesive bonding step. The pressure-sensitive adhesive cures at lower temperatures and shorter times compared to thermal fusion, thereby eliminating the time-consuming high-temperature heat pressing process and improving overall production efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the production of micro flow channel chips with high shape accuracy and efficiency, reducing deformation and improving fluid flow control, allowing for precise treatment and analysis of liquid samples.
Implementation Method 1
an adhesion step of arranging the surface of the base material having a groove formed thereon and the adhesive resin layer of the first laminate to face each other, and bonding the two such that the adhesive resin layer covers the groove
Data Source
AI summary
Provided is a method for producing a micro flow channel chip that is used for a treatment or analysis of a liquid sample, the method being capable of producing a micro flow channel chip with high shape accuracy and high efficiency. The method includes a step of forming a groove on one surface of a base material; a lamination step of forming an adhesive resin layer on at least one surface of a resin film, and thereby obtaining a first laminate; and an adhesion step of arranging the surface of the base material where a groove has been formed and the adhesive resin layer of the first laminate to face each other, and bonding the base material and the first laminate such that the adhesive resin layer covers the groove, in which the glass transition temperature of the adhesive resin layer is 25° C. or lower.