Micro Heat Flux Sensor Array Dual-Side Substrate Design
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Solution Overview
Problem
Conventional heat flux sensors on semiconductor chips act as heat resistances, making it difficult to accurately measure heat flux and determine heat transfer routes, as they alter the heat transfer path.
Innovation Solution
A micro heat flux sensor array is designed with a substrate featuring first and second sensors on either side, each comprising a conductive wiring pattern layer and an insulating layer with via holes for contact, and optionally grooves or protrusions to reduce heat resistance and enhance conductivity, allowing for accurate measurement of heat flux in all directions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional heat flux sensors are placed on the surface of a semiconductor chip, then heat flux measurement is enabled, but the sensors act as heat resistances and alter the heat transfer route, reducing measurement accuracy
Solution Approach 1:
The patent transitions from single-sided surface mounting to dual-sided mounting of heat flux sensors on the substrate. By placing sensors on both the first and second sides of the substrate, the system measures heat flux in multiple directions (vertical and horizontal), enabling accurate determination of heat transfer routes without the sensors acting as heat resistances that alter the thermal path.
2Difficulty of detecting and measuring
If heat flux sensors are mounted on semiconductor chips, then heat flux measurement capability is provided, but the sensors increase heat resistance and prevent accurate measurement
Solution Approach 1:
The patent applies different structural characteristics to different regions of the sensor system. The insulating layer contains via holes at specific locations where electrical contact is needed, while maintaining insulating properties in other areas. This localized structural differentiation allows the sensors to provide measurement capability without uniformly increasing heat resistance across the entire chip surface.
3Adaptability or versatility
If conventional heat flux sensors are used, then basic heat flux detection is achieved, but the heat transfer route is altered and accurate determination of heat transfer path is prevented
Solution Approach 1:
The patent extends the measurement capability from single-direction to multi-directional heat flux detection by implementing sensors on both sides of the substrate. This dimensional expansion allows the system to capture heat transfer information in vertical and horizontal directions simultaneously, preventing loss of heat transfer route information while maintaining the heat flux detection function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The micro heat flux sensor array effectively reduces heat resistance and enables precise measurement of both horizontal and vertical heat flux, improving the accuracy of heat transfer analysis in semiconductor devices.
Implementation Method 1
a first wiring pattern layer of a first conductive material, a second wiring pattern layer of a second conductive material contacting the first wiring pattern layer
Data Source
AI summary
Provided is a micro heat flux sensor array having reduced heat resistance. A micro heat flux sensor array may include a substrate, a plurality of first sensors formed on a first side of the substrate, and a plurality of second sensors formed on a second side of the substrate. Each of the plurality of first and second sensors may include a first wiring pattern layer of a first conductive material, a second wiring pattern layer of a second conductive material contacting the first wiring pattern layer, and an insulating layer in contact with the first and second wiring patterns.