Micro Heat Pipe Structure for Miniaturized IC Package Cooling
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Solution Overview
Problem
Conventional heat spreaders and heat sinks are inadequate for miniaturized chip packages due to their larger dimensions and insufficient heat transfer efficiency, posing a challenge in managing heat generated from IC chips in scaled-down 2D planar or 3D stacking packages.
Innovation Solution
A micro heat transfer component is fabricated using planar processes on a panel or wafer substrate, comprising a top and bottom metal plate with sealed chambers containing a liquid and vapor, utilizing capillary mechanisms for efficient heat removal through vaporization and condensation cycles, suitable for miniaturized chip packages including 2D and 3D stacking configurations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional heat spreaders and heat sinks are used, then heat transfer function is provided, but device size becomes too large for miniaturized chip packages
Solution Approach 1:
The patent employs phase transition of working fluid between liquid and vapor states within the micro heat pipe chamber. The liquid evaporates at the hot end absorbing heat, and vapor condenses at the cold end releasing heat, enabling efficient heat transfer in a miniaturized component. This phase change mechanism allows the heat transfer component to maintain high heat transfer efficiency while achieving compact dimensions suitable for miniaturized chip packages.
2Volume of moving object
If conventional heat spreaders and heat sinks are used, then heat transfer function is provided, but device complexity increases for miniaturized packages
Solution Approach 1:
The patent integrates multiple functions into a single micro heat pipe component: the sealed chamber contains both the working fluid and vapor, metal plates provide structural support and thermal conduction, and capillary structures enable fluid circulation. This merging of functions into one compact component reduces overall device complexity while achieving miniaturization, as the integrated structure replaces what would otherwise require multiple separate components in conventional heat transfer solutions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The micro heat transfer component effectively dissipates heat from IC chips by vaporizing and condensing a liquid within sealed chambers, achieving efficient heat removal suitable for miniaturized chip packages and portable electronic devices.
Implementation Method 1
the liquid in the hot region of the first space is vaporized to become the vapor in the hot region of the second space
Implementation Method 2
the vapor in the hot (high pressure) region of the second space moves to the cool (low pressure) region of the second space by the heat convection mechanism
Implementation Method 3
the vapor in the cool (low pressure) region of the second space is cooled down and condensed to become the liquid in cool (liquid-rich) region of the first space
Implementation Method 4
the liquid flows (based on the capillary mechanism) into the hot (liquid-scarce) region from the cold (liquid-rich) region of the first space
Data Source
AI summary
A micro heat transfer component includes a bottom metal plate; a top metal plate; a plurality of sidewalls each having a top end joining the top metal plate and a bottom end joining the bottom metal plate, wherein the top and bottom metal plates and the sidewalls form a chamber in the micro heat transfer component; a plurality of metal posts in the chamber and between the top and bottom metal plates, wherein each of the metal posts has a top end joining the top metal plate and a bottom end joining the bottom metal plate; a metal layer in the chamber, between the top and bottom metal plates and intersecting each of the metal posts, wherein a plurality of openings are in the metal layer, wherein a first space in the chamber is between the metal layer and bottom metal plate and a second space in the chamber is between the metal layer and top metal plate; and a liquid in the first space in the chamber.