Micro Heat Pipe Soldered to PCB for Thermal Management
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Solution Overview
Problem
Existing PCB assemblies face challenges in efficient heat transfer due to the macroscopic dimensions and mechanical sensitivity of conventional heat pipes, limiting their application and requiring complex installation methods.
Innovation Solution
A micro heat pipe with a pipe wall connected thermally to the outer surface of a PCB board element, allowing for direct and simplified heat transport through soldering, enabling effective heat transfer and distribution without the need for special processing steps, and capable of being used as a heat spreader or heat sink.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat pipes are mechanically mounted on a PCB, then heat transfer is achieved, but the macroscopic dimensions limit their field of application and the mechanical mounting is complex
Solution Approach 1:
The patent replaces the mechanical mounting system with a soldering connection system. The micro heat pipe is soldered directly to the PCB board, eliminating the need for mechanical mounting brackets, clips, or other mechanical fastening mechanisms. This substitution reduces installation complexity while maintaining effective thermal contact through the solder joint.
Solution Approach 2:
The patent changes the dimensional parameters of the heat pipe from macroscopic to microscopic scale. By reducing the diameter to less than or equal to 5mm (preferably less than or equal to 3mm), the heat pipe becomes suitable for direct integration on PCB boards, expanding its field of application to electronic cooling applications where space is limited.
2Adaptability or versatility
If micro heat pipes are used, then the field of application is expanded, but they are sensitive and hard to install mechanically
Solution Approach 1:
The patent replaces mechanical installation methods with soldering. Instead of requiring mechanical mounting procedures that are difficult for sensitive micro heat pipes, the invention uses standard soldering processes to attach the micro heat pipe to the PCB board, significantly improving installation ease while maintaining the advantages of micro-scale dimensions.
3Temperature
If macroscopic heat pipe modules are embedded, then heat dissipation is achieved, but the macroscopic dimensions delimit the field of application
Solution Approach 1:
The patent changes the dimensional parameters from macroscopic to microscopic scale. The micro heat pipe has a diameter of less than or equal to 5mm (preferably less than or equal to 3mm), allowing it to be integrated into compact PCB designs without occupying excessive space, while still providing effective heat dissipation through its high surface-area-to-volume ratio.
4Temperature
If special processing steps are used to connect heat pipes, then thermal connection is achieved, but manufacturing cost and complexity increase
Solution Approach 1:
The patent makes the micro heat pipe connection compatible with standard PCB manufacturing processes. By using soldering, which is already a universal process in PCB fabrication, the invention eliminates the need for special processing steps, reducing manufacturing complexity and cost while achieving reliable thermal connection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a compact, cost-effective, and space-saving thermal connection for improved heat transfer and distribution on PCB assemblies, allowing for efficient cooling or heating of heat sources and enabling integration of multiple functions into the micro heat pipe.
Implementation Method 1
heat pipes are known as heat transfer devices combining the principles of both thermal conductivity and phase transition to transfer heat
Implementation Method 2
heat pipes are known as heat transfer devices combining the principles of both thermal conductivity and phase transition to transfer heat
Implementation Method 3
at least a section of the pipe wall is connected to the outer surface of the PCB board element in a thermally conductive manner
Data Source
AI summary
The present invention provides a PCB assembly. The PCB assembly comprises a PCB board element comprising an outer surface, and a micro heat pipe configured for heat transport. The micro heat pipe has a pipe wall and at least a section of the pipe wall is connected to the outer surface of the PCB board element in a thermally conductive manner. The thermally conductive connection may comprise a solder connection. Thus, a corresponding micro heat pipe may comprise a pipe wall, wherein at least a section of the pipe wall is configured to be soldered to a PCB element. Furthermore, the present invention provides a corresponding method of manufacturing a PCB assembly.