Micro-Heated Chip Bonding for Repair and Replacement
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current chip bonding devices and methods for soldering multiple chips onto a circuit board are inefficient and lack effective solutions for handling damaged chips and chip replacement.
Innovation Solution
A chip transferring and bonding device comprising a signal control module, a substrate carrying module, a chip transferring module, and a chip bonding module with at least one micro heater, which can function as a light source or heat source generator, allowing for precise control of soldering materials to bond or remove chips from the circuit substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional soldering methods are used to bond multiple chips onto a circuit board, then chip bonding can be achieved, but the process is inefficient and lacks effective solutions for damaged chip handling and replacement
Solution Approach 1:
The chip bonding device is designed with multi-functionality to perform multiple operations including chip bonding, damaged chip removal, and chip replacement within a single system. The device integrates heating elements, cooling mechanisms, and precision positioning systems that enable it to adapt to different operational requirements, thereby improving both productivity and adaptability simultaneously
2Adaptability or versatility
If a single chip bonding device is used, then the device structure can be simple, but it cannot perform multiple functions such as chip bonding, damaged chip removal, and chip replacement
Solution Approach 1:
The patent combines multiple functional modules including heating elements, cooling mechanisms, and positioning systems into a single integrated chip bonding device. This merging approach enables the device to perform chip bonding, damaged chip removal, and replacement functions while maintaining a relatively compact and manageable structure, balancing adaptability with device complexity
3Manufacturing precision
If traditional heating methods are used for soldering, then uniform heating can be achieved, but precise control of soldering materials for specific chip locations is difficult
Solution Approach 1:
The device employs heating elements that can be selectively activated for specific chip locations on the circuit board. This local quality approach allows precise control of soldering materials where needed while maintaining uniform heating capabilities when required, enabling precise manufacturing without significantly complicating the operation through selective heating zone activation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient transfer and bonding of chips onto a circuit substrate, facilitates the removal of damaged chips, and allows for chip repair by heating and cooling soldering materials, improving the overall efficiency and reliability of the chip bonding process.
Implementation Method 1
the chip bonding module includes at least one micro heater... the at least one micro heater of the chip bonding module is allowed to heat a corresponding one of the chips
Implementation Method 2
the at least one micro heater of the chip bonding module is a light source generator configured for generating a light source
Implementation Method 3
a heat source generator configured for generating a heat source... heating and cooling soldering materials
Data Source
AI summary
A chip transferring and bonding device includes a signal control module, a substrate carrying module, a chip transferring module and a chip bonding module. The substrate carrying module is configured to be electrically connected to the signal control module. The chip transferring module is configured to be electrically connected to the signal control module. The chip bonding module is configured to be electrically connected to the signal control module. The chip bonding module includes at least one micro heater, and the at least one micro heater of the chip bonding module is a light source generator configured for generating a light source or a heat source generator configured for generating a heat source. When the chip bonding module is optionally configured to be used, the micro heater of the chip bonding module can be allowed to heat a corresponding one of the chips through the signal control module.