Micro Heater Chip Carrier for Solder Yield
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Solution Overview
Problem
Current reflow processes for soldering electronic components on circuit boards face challenges in improving yield and reducing production costs, despite using methods like reflow furnaces, infrared heating lamps, or heat guns.
Innovation Solution
A chip carrier structure featuring a non-circuit substrate with micro heaters and an adhesive layer, where micro heaters are used to heat solder balls, enhancing the soldering process by improving yield and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional reflow methods (reflow furnace, infrared heating lamp, or heat gun) are used, then the soldering process can be performed, but the soldering yield is insufficient and production cost is high
Solution Approach 1:
The patent divides the heating function into multiple independent micro heaters, each corresponding to a specific solder ball location. This segmentation allows localized heating control, improving soldering yield by ensuring each solder ball receives adequate heat while reducing overall energy consumption and production cost.
Solution Approach 2:
The patent implements local quality by providing dedicated heating zones for different solder balls through individually controllable micro heaters. Each micro heater can be activated independently based on the specific heating requirements of its corresponding solder ball, optimizing both yield and cost efficiency.
2Manufacturing precision
If conventional reflow methods are used, then soldering can be performed, but temperature control precision is insufficient
Solution Approach 1:
By segmenting the heating system into multiple independent micro heaters, the patent enables precise temperature control for each solder ball location. Each micro heater can be controlled independently, allowing fine-tuned temperature management that improves manufacturing precision without requiring a single complex heating system.
Solution Approach 2:
The patent introduces a control system that acts as an intermediary between the power source and multiple micro heaters. This intermediary manages the complex routing of electrical signals to individual heaters, simplifying the overall control architecture while maintaining precise temperature control capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The described solution improves soldering yield by effectively heating solder balls, reducing production costs, and allowing for precise temperature control, thereby enhancing the electrical connection of chips to circuit substrates.
Implementation Method 1
at least one micro heater heats at least one the solder ball that the chip is in contact with
Data Source
AI summary
The present invention provides a chip carrier structure including: a non-circuit substrate, a plurality of micro heaters, and an adhesive layer. The micro heaters are disposed on the non-circuit substrate. The adhesive layer is disposed on the micro heaters, and a plurality of chips are disposed on the adhesive layer. Thereby, the present invention improves the solder yield of the process by a wafer carrying structure and a wafer carrying device.