Micro-hoses for Integrated Circuit Cooling

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Solution Overview

Problem

Conventional cooling methods for small electronic components, such as circuit boards, are complex and costly due to the need for reliable seals and bulky connectors, which are not feasible in space-constrained applications, and immersion cooling requires large, bulky housings prone to leakage.

Innovation Solution

Additive manufacturing is used to directly form complex micro-sized hollow features, such as micro-hoses, on heat-dissipating devices, allowing for efficient delivery of coolant without additional bonding materials or connectors, enabling direct thermal contact and improved cooling efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If separate cooling manifolds or structures are bonded to the electronics assembly, then cooling function is provided, but fabrication complexity and cost increase due to the need for reliable seals

Engineering Contradiction:

Improvecooling functionVSAvoidfabrication complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The cooling manifold is merged with the circuit board by directly forming fluid passages within the board structure itself, eliminating the need for separate cooling structures and their associated sealing requirements. This integration reduces fabrication complexity while maintaining reliable cooling function.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The sealing function is extracted from the cooling system design by using self-sealing features inherent in the additive manufacturing process, where the fluid passages are directly formed within the board material without requiring additional sealing components or complex bonding procedures.

Inventive Principle:

Principle #2Taking out (Extraction)

2Ease of operation

If fluidic spreaders with bulky connectors are used, then fluid delivery is enabled, but space constraints of the electronic assembly are violated

Engineering Contradiction:

Improvefluid deliveryVSAvoidspace occupation

Core Design Contradiction:

Ease of operationVSVolume of moving object

Solution Approach 1:

The fluid delivery system is segmented into multiple small-scale fluid passages distributed throughout the circuit board, replacing the need for a single bulky connector and large-scale fluidic spreader. This segmentation enables fluid delivery while accommodating space constraints.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The fluid passages are integrated within the planar structure of the circuit board, utilizing the board's thickness dimension to route coolant channels. This approach eliminates the need for bulky three-dimensional connectors while maintaining fluid delivery capability.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Reliability

If immersion cooling is used, then cooling is provided, but large bulky housings are required that are prone to leakage

Engineering Contradiction:

Improvecooling functionVSAvoidhousing volume

Core Design Contradiction:

ReliabilityVSVolume of stationary object

Solution Approach 1:

The cooling function is merged directly into the circuit board structure through integrated fluid passages, eliminating the need for a separate immersion cooling housing. This reduces the overall volume while providing reliable cooling through direct fluid contact with heat-generating components.

Inventive Principle:

Principle #5Merging (Combining)

4Reliability

If epoxy seals or o-rings are used to seal fluid channels, then fluid containment is achieved, but fabrication becomes complex and costly

Engineering Contradiction:

Improvefluid containmentVSAvoidfabrication complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The sealing function is extracted from the assembly process and inherent in the additive manufacturing structure itself. The fluid passages are directly formed within the board material, creating self-contained channels that eliminate the need for separate sealing components like epoxy or o-rings.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The additive manufacturing process creates self-sealing fluid passages through the board material, where the structure itself provides the containment function without requiring additional sealing services or components. The passages are inherently sealed by the solid board material surrounding them.

Inventive Principle:

Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces the complexity and cost of cooling systems, increases power output, and allows for more efficient heat dissipation, potentially doubling the power dissipation capacity to around 220 watts, while minimizing the volume and weight of the cooling structure.

Implementation Method 1

the cooling medium being in thermal contact directly with the heat-dissipating surface

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS9960101B2Micro-hoses for integrated circuit and device level cooling

Publication Date: 2018.05.01 RAYTHEON CO

AI summary

A heat-dissipating device includes at least one heat-dissipating surface and a micro-sized cooling mechanism formed directly on the heat-dissipating surface by an additive manufacturing process. The cooling mechanism includes at least one fluid passage, such as a micro-hose, for carrying a cooling medium from a coolant source directly to the heat-dissipating surface. The cooling mechanism is fluidly sealed to the heat-dissipating surface such that the cooling medium is in thermal contact directly with the heat-dissipating surface.