Micro Component Housing Assembly with Segmented Through-Holes
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Solution Overview
Problem
Existing techniques for forming structures with through-holes for micro components, such as optoelectronic devices, often rely on costly silicon-on-insulator (SOI) structures and lack flexibility in through-hole shape and size, limiting their application and efficiency.
Innovation Solution
A method involving the use of two sub-structures where a first sub-structure with a larger through-hole is attached to a second sub-structure with smaller through-holes, allowing for various etching processes to create diverse shapes and sizes, and thinning techniques like chemical-mechanical polishing to facilitate hermetic feed-through metallization, using materials like silicon or glass for cost-effectiveness and flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If silicon-on-insulator (SOI) structures are used to form through-holes for micro components, then hermetic sealing and electrical connectivity are achieved, but material costs increase significantly
Solution Approach 1:
The structure is divided into two separate sub-structures: a first sub-structure providing hermetic sealing through a large through-hole, and a second sub-structure providing electrical connectivity through smaller through-holes. This segmentation allows each sub-structure to be optimized independently, enabling the use of cost-effective materials like silicon or glass instead of expensive SOI structures, while maintaining both hermetic sealing and electrical connectivity functions.
2Adaptability or versatility
If traditional single-structure approaches are used for through-holes, then structural simplicity is maintained, but flexibility in through-hole shape and size is limited
Solution Approach 1:
Dividing the structure into two sub-structures enables independent optimization of through-hole characteristics. The first sub-structure can have a large through-hole with specific shape for hermetic sealing, while the second sub-structure can have smaller through-holes with different shapes for electrical connectivity. This segmentation provides flexibility in designing through-holes of various shapes and sizes without being constrained by a single monolithic structure.
Solution Approach 2:
Different regions of the assembly have different functional requirements, and this principle allows each sub-structure to have locally optimized properties. The first sub-structure is optimized for hermetic sealing with a large through-hole, while the second sub-structure is optimized for electrical connectivity with smaller through-holes. This local quality approach enables tailored design of through-hole shapes and sizes in different locations to meet specific functional demands.
3Manufacturing precision
If a single sub-structure is used for both sealing and connectivity functions, then manufacturing processes are simplified, but precision control over different through-hole sizes is compromised
Solution Approach 1:
The segmentation into two sub-structures enables precise control over different through-hole sizes. The first sub-structure can be manufactured with a large through-hole optimized for hermetic sealing, while the second sub-structure can be manufactured with smaller through-holes optimized for electrical connectivity. Each sub-structure can be processed independently using appropriate manufacturing techniques, achieving high precision for each function without compromise.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the formation of cost-effective, flexible, and hermetically sealed structures with precise control over through-hole shapes and sizes, enhancing the encapsulation and connectivity of micro components while reducing material costs compared to SOI structures.
Implementation Method 1
The thinning process may include, for example, a chemical-mechanical polishing process
Data Source
AI summary
Formation of a structure with through-holes includes attaching two sub-structures to one another. The resulting structure may be used in a sub-assembly for various types of micro components and may serve as a lid or base of a housing that encapsulates one or more micro components. The techniques may provide greater flexibility in the shape of the through-holes and may reduce costs compared with other known techniques.