Micro Image Detector Segmentation and Transfer Process
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Solution Overview
Problem
Conventional X-ray imaging technologies face limitations in achieving high resolution and fast operation speed while maintaining low manufacturing costs and flexibility.
Innovation Solution
An image detector design featuring a substrate with a circuit layer, light detecting elements, driving elements, and a crystal scintillation layer, where the light detecting elements and driving elements are independently formed and transferred using different processes, allowing for high resolution and fast operation with low-cost manufacturing and high application flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional X-ray imaging technology uses imaging film or flat-type digital image sensitive plate, then the manufacturing cost is low and the structure is simple, but the resolution and operation speed are limited
Solution Approach 1:
The detector is divided into multiple detecting areas arranged in an array on the substrate, with each area containing light detecting elements and driving elements. This segmentation allows for high-resolution imaging while maintaining a relatively simple overall structure through modular design.
Solution Approach 2:
The patent transitions from traditional two-dimensional film-based detection to a multi-layer three-dimensional structure, with the circuit layer on the substrate, light detecting elements above it, and crystal scintillation layer covering the detecting areas, enabling higher resolution without proportionally increasing structural complexity.
2Productivity
If the light detecting elements and driving elements are formed by the same process as the circuit layer, then the manufacturing process is simple, but the resolution and operation speed are limited
Solution Approach 1:
The light detecting elements and driving elements are formed by a process different from the circuit layer formation, allowing for optimized fabrication sequences and preliminary preparation of critical components before final assembly, thereby improving operation speed while managing manufacturing complexity.
Solution Approach 2:
The patent introduces an intermediate transfer step where the light detecting elements and driving elements are transferred to the detecting areas after being formed separately. This intermediary process enables independent optimization of each component's fabrication while maintaining overall manufacturing feasibility.
3Measurement precision
If the detecting areas are made smaller to achieve higher resolution, then the image resolution improves, but the manufacturing precision requirements increase
Solution Approach 1:
The detector surface is segmented into multiple discrete detecting areas, each with defined boundaries. This segmentation approach allows for standardized manufacturing of individual areas that can be precisely positioned in an array, achieving high resolution without requiring excessive precision across the entire detector surface.
Solution Approach 2:
The patent specifies that the width of each detecting area is equal to or less than 70 μm, optimizing the balance between resolution and manufacturability. This parameter optimization enables high resolution while keeping manufacturing precision requirements at achievable levels through the transfer process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The image detector provides high resolution and fast operation speed while maintaining low manufacturing costs and offering high application flexibility, surpassing conventional X-ray imaging devices.
Implementation Method 1
a crystal scintillation layer arranged opposite to the substrate and covering the detecting areas
Implementation Method 2
Each of the light detecting elements is a III-V compound light sensor, a II-VI compound light sensor, or a silicon-based light sensor
Data Source
AI summary
An image detector includes a substrate, a circuit layer, a plurality of light detecting elements, a plurality of driving elements and a crystal scintillation layer. The substrate has a surface. The circuit layer is arranged on the surface of the substrate, and defines a plurality of detecting areas arranged in an array. The light detecting elements and the driving elements are disposed at the detecting areas and electrically connected with the circuit layer. Each driving element drives one or more of the light detecting elements. The crystal scintillation layer is arranged opposite to the substrate and covers the detecting areas. The light detecting elements and the driving elements connect with the surface of the substrate. At least one of the light detecting elements and the driving elements is formed by a process different from the process of forming the circuit layer on the substrate.