Micro-Isolator Dielectric Encapsulation for Higher Breakdown Voltage
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Micro-isolators face challenges in achieving high breakdown voltage to prevent electrical breakdown and undesirable voltage cross-over between circuits operating at different voltage domains, necessitating enhanced isolation techniques.
Innovation Solution
The use of a micro-isolator design featuring a first and second isolator element separated by a first dielectric material, with a second dielectric material encapsulating the second isolator element or positioned at its outer corners, utilizing wide bandgap materials to prevent triple point junctions and electrostatic charge injection, thereby increasing breakdown voltage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single dielectric material is used between isolator elements, then the structure is simple, but the breakdown voltage is insufficient to prevent electrical breakdown and voltage cross-over
Solution Approach 1:
The dielectric structure is segmented into multiple layers with different materials: a first dielectric material directly between the isolator elements, and a second dielectric material with wider bandgap enclosing the isolator elements. This segmentation allows each layer to perform its specific function optimally, achieving high breakdown voltage while managing electrical stress distribution
Solution Approach 2:
The patent employs composite dielectric materials with different bandgap widths. The first dielectric material provides base insulation, while the second dielectric material with wider bandgap provides enhanced electrical stress resistance. This composite approach combines the advantages of different materials to achieve superior breakdown voltage performance
2Volume of moving object
If isolator elements are placed close together for compact design, then the device size is reduced, but electrical breakdown and voltage cross-over become more likely
Solution Approach 1:
The isolator elements are nested within the second dielectric material, which acts as a protective enclosure. This nesting structure allows compact placement of isolator elements while the surrounding wide bandgap dielectric material provides enhanced electrical isolation, preventing breakdown even at close spacing
Solution Approach 2:
The first dielectric material acts as an intermediary layer between the isolator elements, providing base electrical isolation. The second dielectric material with wider bandgap serves as an additional intermediary barrier, enhancing the isolation effect and enabling closer placement of isolator elements without compromising reliability
3Ease of manufacture
If triple point junctions are formed between isolator elements and dielectric materials, then manufacturing is simplified, but electrostatic charge injection occurs reducing breakdown voltage
Solution Approach 1:
The patent applies different dielectric materials at different locations: the first dielectric material is positioned where it provides adequate insulation, while the second dielectric material with wider bandgap is strategically placed at critical regions such as outer corners and interfaces to prevent charge injection. This local differentiation eliminates triple point junctions at critical locations while maintaining manufacturing feasibility
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively enhances the breakdown voltage of micro-isolators, ensuring reliable electrical isolation and signal communication across voltage domains while preventing voltage cross-over and electrical conductance.
Implementation Method 1
The second dielectric material may be configured to reduce electrostatic charge injection into the first dielectric material
Implementation Method 2
utilizing wide bandgap materials to prevent triple point junctions and electrostatic charge injection
Data Source
AI summary
A micro-isolator is described. The micro-isolator may include a first isolator element, a second isolator element, and a first dielectric material separating the first isolator element from the second isolator element. A second dielectric material may completely or partly encapsulate the second isolator element, or may be present at outer corners of the second isolator element. The second dielectric material may have a larger bandgap than the first dielectric material, and its configuration may reduce electrostatic charge injection into the first dielectric material. The micro-isolator may be formed using microfabrication techniques.


