Micro-jet Chip Cooling with Integrated Pump and Heat Exchanger
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High power chips, especially those with heat flux over 350 W/cm² or hot spots exceeding 10 KW/cm², face challenges in dissipating heat effectively when packaged in forms like ball grid array (BGA), leading to difficulties in thermal management.
Innovation Solution
A heat dissipation system is introduced for high power chip packages, featuring a built-in micro-jet attached to the chip, connected to a micro-pump and a heat exchanger on a single printed circuit board, utilizing a micro-jet chamber with a separator and coolant like deionized water or liquid metal to absorb heat and transfer it to the heat exchanger.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional packaging forms like BGA are used for high power chips, then the chip can be packaged and mounted, but heat dissipation becomes difficult leading to thermal management problems
Solution Approach 1:
The invention segments the heat dissipation function by introducing a micro-jet chamber with multiple micro-nozzles that distribute coolant across the chip surface. This segmentation allows localized heat removal from high heat flux regions, effectively addressing thermal management challenges in conventional BGA packages.
Solution Approach 2:
The invention employs hydraulic principles by implementing a liquid coolant circulation system. The micro-pump drives coolant through channels to the micro-jet chamber, where it is sprayed onto the chip surface for heat absorption, then collected and recirculated through a heat exchanger. This hydraulic approach enables active heat dissipation in a compact package.
2Temperature
If a heat dissipation system with micro-jet, micro-pump and heat exchanger is added to the package, then heat dissipation efficiency improves, but device complexity increases
Solution Approach 1:
The invention merges multiple heat dissipation components (micro-jet chamber, micro-pump, heat exchanger, and coolant channels) into a single integrated heat dissipation system that functions as a unified thermal management solution. This integration reduces the number of separate components and simplifies the overall package structure while maintaining effective heat dissipation.
Solution Approach 2:
The coolant serving liquid performs multiple functions: it cools the chip through the micro-jet, absorbs heat in the heat exchanger, and is recirculated by the micro-pump. This multi-functional approach eliminates the need for separate cooling mechanisms, reducing system complexity while achieving effective heat dissipation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances heat dissipation by ensuring temperature uniformity and preventing local hotspots, thereby increasing the reliability and efficiency of high power chip packages such as fcBGA, wbBGA, 2.5D/3D TSV, and PoP packages.
Implementation Method 1
utilizing a micro-jet chamber with a separator and coolant like deionized water or liquid metal to absorb heat and transfer it to the heat exchanger
Implementation Method 2
A micro-pump is in fluidic communication with the micro-jet. A heat exchanger is in fluidic communication with the micro-pump
Data Source
AI summary
A solution for dissipating heat generated from high power chip packages, e.g., a fcBGA package, wbBGA package, 2.5D/3D TSV package, PoP, etc. The heat dissipation system may include a high power chip package including a high power chip. A micro-jet may be attached to the high power chip. A micro-pump may be in fluidic communication with the micro-jet. A heat exchanger may be in fluidic communication with the micro-pump. The high power chip package is assembled on the same PCB with the micro-pump and the heat exchanger.