Micro-layered Lead Frame for SiP Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor packages face challenges in miniaturization and heat dissipation while maintaining electrical and mechanical connectivity, especially in applications requiring high input/output capabilities and compact sizes.
Innovation Solution
The semiconductor packages incorporate a system-in-a-package design featuring a leadframe with a land pad array, multiple semiconductor dies, thermal pads, and a metal cladding layer, which allows for efficient heat dissipation and optimized routing, enabling a thinner package size with enhanced I/O capabilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If conventional semiconductor packages are miniaturized, then package size is reduced, but heat dissipation capability deteriorates
Solution Approach 1:
The patent introduces thermal pads extending in the lateral dimension rather than relying solely on vertical heat conduction through the package thickness. The thermal pads are formed as laterally extending structures that conduct heat away from the semiconductor die in the plane of the package, effectively adding a lateral heat dissipation dimension to complement the traditional vertical path.
Solution Approach 2:
The heat dissipation function is segmented into multiple independent thermal pads rather than a single centralized thermal path. Each thermal pad can be independently positioned and sized to optimize heat extraction from different regions of the semiconductor die, distributing the thermal management load across multiple locations within the package.
2Productivity
If multiple semiconductor dies are integrated in a package, then input/output capabilities are improved, but device complexity increases
Solution Approach 1:
The leadframe structure is designed to serve multiple functions simultaneously: it provides mechanical support for multiple semiconductor dies, establishes electrical connections through integrated circuit boards, conducts thermal energy away from active components, and enables input/output signal transmission. This multi-functionality reduces the need for separate dedicated structures for each function.
Solution Approach 2:
The patent combines thermal management, electrical connection, and mechanical support functions into a single integrated leadframe structure. The thermal pads and electrical leads are merged into the same structural framework, eliminating the need for separate thermal management components and reducing overall package complexity despite the presence of multiple dies.
3Length of moving object
If package thickness is reduced, then miniaturization is achieved, but manufacturing precision requirements increase
Solution Approach 1:
The leadframe is constructed as a thin, flexible structure that can be formed into complex three-dimensional configurations including laterally extending thermal pads and interconnected leads. This thin-film approach enables the creation of sophisticated thermal and electrical management structures within a reduced thickness envelope without requiring excessively tight manufacturing tolerances.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution results in semiconductor packages that are thinner, with improved heat dissipation and higher input/output capabilities compared to conventional packages, achieving a balance between miniaturization and performance.
Implementation Method 1
The packages also contain thermal pads which operate as a heat sink.
Data Source
AI summary
Semiconductor packages that contain a system-in-a-package and methods for making such packages are described. The semiconductor packages contain a first semiconductor die resting on a middle of a land pad array, a second die disposed over the first die and resting on routing leads that are connected to the land pad array, a third die resting on the backside of the second die and connected to the land pad array by wire bonds, and a passive device and/or a discrete device resting on device pads. The packages also contain thermal pads which operate as a heat sink. The land pad array is formed from etching the leadframe. The semiconductor packages have a full land pad array with a thin package size while having a system-in-a-package design. Other embodiments are also described.