Micro LED Anisotropic Conductive Film Bonding
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Solution Overview
Problem
Current methods for transferring and bonding micro LEDs to substrates face issues such as damage from electrostatic charges, adhesive force requirements, manufacturing complexity, and conduction problems due to the small size and close spacing of the LEDs, leading to inefficiencies and potential electrical short-circuits.
Innovation Solution
A micro LED structure utilizing an anisotropic conductive film filled with conductive material in vertically formed holes within an insulating porous film, which electrically connects the micro LED to the target substrate while preventing horizontal conduction and providing heat dissipation and insulation, thereby improving bonding efficiency and luminous efficacy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional pick-and-place machine is used for transferring micro LEDs, then transfer process is simple, but transfer precision is insufficient for 1 μm to 100 μm LED size
Solution Approach 1:
The transfer head is segmented into multiple independent pickup elements arranged in an array, each capable of independently grasping and transferring micro LEDs. This segmentation enables precise positioning and transfer of individual micro LEDs while maintaining a manageable overall structure.
Solution Approach 2:
A temporary substrate is introduced as an intermediary carrier to hold the micro LED array before transfer. This intermediary structure simplifies the transfer process by allowing bulk handling of multiple micro LEDs while maintaining individual precision through the segmented pickup elements.
2Manufacturing precision
If electrostatic head is used for transferring micro LED, then transfer precision is improved, but micro LED may be damaged due to electrification
Solution Approach 1:
The temporary substrate acts as an intermediary that holds micro LEDs during the transfer process, eliminating the need for direct electrostatic contact with the micro LEDs themselves. This mediator approach maintains transfer precision while avoiding electrification damage to the delicate micro LED structures.
Solution Approach 2:
The invention replaces the electrostatic field-based pickup mechanism with a mechanical contact-based segmented pickup system. This substitution eliminates the harmful electrification effects while maintaining the ability to precisely grasp and transfer micro LEDs through controlled mechanical contact.
3Object-affected harmful factors
If elastic polymer material is used as transfer head, then micro LED damage is reduced, but adhesive force must be higher than target substrate
Solution Approach 1:
The pickup head is divided into multiple small segmented elements, each with minimal adhesive force requirements. This segmentation reduces the total adhesive force needed compared to a single large elastic polymer head, while still providing sufficient grip on individual micro LEDs through the combined effect of multiple small contact points.
Solution Approach 2:
Different regions of the transfer system have different adhesive properties optimized for their specific functions. The segmented pickup elements have localized adhesive characteristics tailored for grasping micro LEDs, while the temporary substrate has adhesive properties optimized for releasing micro LEDs onto the target substrate, avoiding the need for uniformly high adhesive force throughout the system.
4Manufacturing precision
If micro LEDs are closely spaced on substrate, then display resolution is improved, but conduction problems and electrical short-circuits occur
Solution Approach 1:
The temporary substrate serves as an intermediary platform that maintains precise spatial arrangement of micro LEDs during transfer. This intermediary structure ensures that micro LEDs are positioned with accurate spacing on the target substrate, preventing conduction problems and electrical short-circuits while achieving high display resolution through precise positioning control.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The anisotropic conductive film structure effectively addresses conduction and bonding issues, enhancing the electrical connection and heat management of micro LEDs, reducing the risk of electrical short-circuits and improving the overall performance and efficiency of micro LED displays.
Implementation Method 1
the anisotropic conductive film is formed by filling a conductive material in a plurality of holes formed vertically in an insulating porous film of elastic material, and the conductive material electrically connects the micro LED and the target substrate together
Implementation Method 2
the anisotropic conductive film provided between the micro LED and the target substrate, wherein the anisotropic conductive film is formed by filling a conductive material in a plurality of holes formed vertically
Data Source
AI summary
The present invention relates generally to a micro LED structure and a method of manufacturing the same, and more particularly to a micro LED structure having an anisotropic conductive film between a micro LED and a target substrate to which the micro LED is bonded for electrically connect the micro LED and the target substrate together, and a method of manufacturing the same.