Micro LED Adhesive Interconnects to Prevent Pixel Detachment
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Solution Overview
Problem
Micro LEDs fixed by solder on pixel array substrates are prone to falling off due to heat or impact during manufacturing processes, leading to operational failures in micro LED displays.
Innovation Solution
The use of an anisotropic conductive adhesive structure between the circuit substrate and micro LEDs, which electrically connects the substrate to the LEDs' lower electrode and includes a conductive connection element connecting the upper electrode to the substrate, ensuring secure attachment and reducing the risk of falling off.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder is used to fix micro LEDs to the pixel array substrate, then electrical connection is achieved, but the micro LEDs are likely to fall off due to heat or impact during subsequent processes
Solution Approach 1:
The patent introduces an anisotropic conductive adhesive layer as an intermediary between the micro LED and the substrate. This adhesive layer serves as a mediator that provides both mechanical support (resisting heat and impact) and electrical connection, eliminating the vulnerability of direct solder connections to thermal and mechanical stress
Solution Approach 2:
The patent employs a composite structure combining the anisotropic conductive adhesive layer with the substrate and micro LED. This composite material approach integrates the adhesive's flexibility and thermal resistance with the electrical conductivity requirements, creating a robust connection that withstands manufacturing process stresses
2Reliability
If the anisotropic conductive adhesive structure is positioned to cover the lower electrode and light-emitting layer, then the LED is securely fixed, but the structure complexity increases
Solution Approach 1:
The patent segments the adhesive application into specific functional zones: the anisotropic conductive adhesive layer is positioned to cover the lower electrode and light-emitting layer areas where fixation is most critical. This segmented approach provides secure fixation only where needed, rather than applying adhesive uniformly across the entire device, thereby reducing unnecessary structural complexity
3Reliability
If conductive connection element is used to connect upper electrode to circuit substrate, then electrical connection is established, but the manufacturing difficulty increases due to potential short circuits and breakage
Solution Approach 1:
The anisotropic conductive adhesive layer serves as an intermediary that facilitates the connection between the upper electrode and the circuit substrate. This adhesive mediator provides a controlled conductive path that eliminates the risk of short circuits and breakage associated with direct conductive connection elements, thereby simplifying the manufacturing process while maintaining connection reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces the probability of micro LED detachment and simplifies the manufacturing process by providing a stable electrical connection that withstands heat and impact, enhancing the reliability of micro LED displays.
Implementation Method 1
an anisotropic conductive adhesive structure, where the adhesive structure is positioned to cover the lower electrode and light-emitting layer of the diode
Implementation Method 2
The anisotropic conductive adhesive structure effectively secures the LEDs to the substrate
Implementation Method 3
A light-emitting diode (LED) is an electroluminescent semiconductor element
Data Source
AI summary
A display device including a circuit substrate, a first light-emitting diode, an anisotropic conductive adhesive structure, and a conductive connection element is provided. The first light-emitting diode is located above the circuit substrate. The anisotropic conductive adhesive structure is located between the circuit substrate and the first light-emitting diode, and electrically connects the circuit substrate to a lower electrode of the first light-emitting diode. The conductive connection element electrically connects the upper electrode of the first light-emitting diode to the circuit substrate. A portion of the conductive connection element is located on the anisotropic conductive adhesive structure.