Micro LED Adhesive Layout for Precise Room-Temperature Transfer
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Solution Overview
Problem
Existing light emitting diode (LED) display technologies face challenges in mass transfer accuracy, leading to misalignment of micro LEDs during the transfer process from the growing substrate to the active device substrate, affecting normal operation.
Innovation Solution
A light emitting device design that includes a substrate with first and second pads, a patterned adhesive layer, and connection structures, where the adhesive layer does not contact the connection structures, allowing for precise alignment and transfer of LEDs without additional heating, reducing process time and avoiding adhesive contamination.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If additional heating is applied during the transfer process to improve adhesion, then bonding strength is improved, but alignment accuracy deteriorates due to apparatus deformation
Solution Approach 1:
The patent changes the temperature parameter from high to room temperature during the transfer process. The adhesive layer is designed to function effectively at room temperature without requiring additional heating, thereby avoiding apparatus deformation and maintaining alignment accuracy while still achieving sufficient bonding strength.
2Strength
If the adhesive layer contacts the connection structures to ensure complete coverage, then adhesion is improved, but contamination of connection structures occurs
Solution Approach 1:
The patent segments the substrate surface into distinct functional zones: an adhesive layer region and connection structure regions. The adhesive layer is positioned to cover only the active device area while deliberately excluding the connection structures, achieving complete adhesion coverage where needed without contaminating the connection structures.
Solution Approach 2:
The adhesive layer is applied with local quality differentiation - it provides full coverage and strong adhesion in the active device region, while completely avoiding the connection structure regions. This localized application strategy ensures adhesion where required without causing contamination elsewhere.
3Manufacturing precision
If the transfer process is extended to improve alignment precision, then manufacturing precision is improved, but productivity decreases
Solution Approach 1:
The patent performs preliminary action by pre-positioning the adhesive layer on the substrate before the transfer process. This pre-prepared adhesive layer enables the transferred LED to be immediately and accurately positioned upon contact, eliminating the need for extended transfer processes and maintaining high productivity while achieving precise alignment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances alignment accuracy of LEDs, reduces process time, and prevents misalignment due to transfer apparatus deformation, while maintaining luminous efficiency and avoiding adhesive material contamination.
Implementation Method 1
A patterned adhesive layer is located between the substrate and the light emitting diode and does not contact the first connection structure and the second connection structure
Data Source
AI summary
A light emitting device including a substrate, a first pad, a second pad, a light emitting diode, a first connection structure, a second connection structure, and a patterned adhesive layer and a method for manufacturing the same are provided. The first pad and the second pad are located on the substrate. The light emitting diode includes a first semiconductor layer, a second semiconductor layer overlapping the first semiconductor layer, a first electrode and a second electrode. The first electrode and the second electrode are respectively connected to the first semiconductor layer and the second semiconductor layer. The first connection structure electrically connects the first electrode to the first pad. The second connection structure electrically connects the second electrode to the second pad. The patterned adhesive layer is located between the substrate and the light emitting diode and does not contact the first connection structure and the second connection structure.