Micro LED Transfer Using Stepped Adhesive Patterns for Full-Color Displays
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Solution Overview
Problem
Current methods for transferring micro LEDs to wiring substrates require multiple transfers, leading to positional accuracy issues, increased costs, and interference between previously transferred LEDs, making it challenging to achieve full-color displays efficiently.
Innovation Solution
A method involving adhesive patterns with different heights on wiring electrodes and LEDs, allowing direct transfer from a growth substrate to a wiring substrate, with adhesive and transfer properties, enabling simultaneous bonding and reducing the number of transfers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple transfers are used to transfer micro LEDs from LED wafers to wiring substrate, then full-color display capability is achieved, but positional accuracy deteriorates and transfer cost increases
Solution Approach 1:
A temporary substrate is introduced as an intermediary carrier to hold multiple types of micro LEDs (red, green, blue) in their respective transfer regions. This mediator enables simultaneous transfer of all color LEDs to the wiring substrate in a single operation, achieving full-color display capability while maintaining positional accuracy and reducing transfer steps.
Solution Approach 2:
Multiple types of micro LEDs are pre-positioned on the temporary substrate in their respective transfer regions before the transfer process. This preliminary arrangement allows all LEDs to be transferred simultaneously to their correct positions on the wiring substrate, eliminating the need for multiple sequential transfers and preventing positional accuracy deterioration.
2Adaptability or versatility
If multiple transfers are performed for RGB LEDs, then full-color implementation is achieved, but transfer frequency increases and cost increases
Solution Approach 1:
The transfer processes for red, green, and blue LEDs are merged into a single simultaneous transfer operation. All three types of LEDs are positioned on the temporary substrate and transferred together to the wiring substrate in one step, achieving full-color implementation while reducing transfer frequency from multiple operations to a single operation.
3Ease of manufacture
If individual transfers are performed for each LED type, then selective transfer is achieved, but interference between previously transferred LEDs occurs
Solution Approach 1:
All types of micro LEDs are pre-positioned on the temporary substrate in their respective transfer regions before the transfer process. This preliminary arrangement ensures that when transfer occurs, all LEDs are transferred simultaneously to their correct positions on the wiring substrate, preventing interference between previously transferred LEDs while maintaining selective transfer capability through dedicated transfer regions.
Data Source
AI summary
The present disclosure is applicable to a technical field related to a display device, and relates to: a display device using, for example, a micro light-emitting diode (LED); and a manufacturing method therefor. In order to accomplish the described objective, the present disclosure may comprise the steps of: preparing a growth substrate having light-emitting elements; preparing a wiring substrate having wiring electrodes; forming a first adhesive pattern on a first wiring electrode from among the wiring electrodes and/or a first light-emitting element from among the light-emitting elements; transferring the first light-emitting element onto the first wiring electrode so that the first light-emitting element from among the light-emitting elements is adhered to the first wiring electrode by means of the first adhesive pattern; forming, on a second wiring electrode adjacent to the first wiring electrode from among the wiring electrodes and/or a second light-emitting element adjacent to the first light-emitting element from among the light-emitting elements, a second adhesive pattern having a height that differs from the height of the first adhesive pattern; and transferring the second light-emitting element onto the second wiring electrode so that the second light-emitting element from among the light-emitting elements is adhered to the second wiring electrode by means of the second adhesive pattern.