Micro LED Display Isolation Layer With Air Gaps for Short-Circuit Prevention
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Solution Overview
Problem
The manufacturing yield of micro light emitting diode displays is low due to the risk of short-circuiting during the transfer and bonding process, where the miniaturization of light emitting diodes results in close electrode pads that can be short-circuited by overflowing connection pads.
Innovation Solution
A micro light emitting device display apparatus is designed with a substrate, micro light emitting devices, an isolation layer, and air gaps. The isolation layer is placed between the substrate and the micro light emitting devices, and air gaps are located between the substrate and the isolation layer, acting as a buffer space during the bonding process to prevent short-circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If micro light emitting diodes are miniaturized to improve display resolution and reduce pixel pitch, then the display quality and density are improved, but the distance between electrode pads is shortened which increases the risk of short-circuiting during transfer and bonding
Solution Approach 1:
A temporary substrate is introduced as an intermediary carrier to hold the micro light emitting diodes during the transfer process. The micro LEDs are first fabricated on this temporary substrate, then transferred to the final display substrate. This intermediary structure allows for controlled handling and positioning, preventing short-circuits between the closely-spaced electrode pads during transfer and bonding operations.
2Strength
If connection pads are heated to molten state for bonding micro light emitting devices to substrate, then the bonding strength is improved, but the connection pads may overflow and cause short-circuiting between electrode pads
Solution Approach 1:
The temporary substrate structure is designed with pre-established positioning features and alignment marks that guide the precise placement of micro light emitting diodes before bonding. This preliminary arrangement ensures that even when connection pads are heated to molten state for strong bonding, the overflow is contained and directed away from the electrode pads, preventing short-circuits while maintaining bonding strength.
3Length of moving object
If the distance between electrode pads is shortened to enable miniaturization, then the pixel density and resolution are improved, but the risk of short-circuiting during transfer and bonding increases
Solution Approach 1:
The transfer process is segmented into distinct stages: fabrication on temporary substrate, alignment positioning, and controlled bonding to final substrate. The temporary substrate acts as a separate fabrication and handling platform, allowing the micro LEDs with short electrode pad distances to be prepared and positioned without risk of short-circuiting, then transferred in a controlled manner to the final display substrate.
Data Source
AI summary
A micro light emitting device display apparatus including a substrate, a plurality of micro light emitting devices, an isolation layer, and at least one first air gap is provided. The substrate has a plurality of connection pads. The micro light emitting devices are discretely disposed on the substrate. The isolation layer is disposed between the substrate and each of the micro light emitting devices. The at least one first air gap is disposed between the substrate and a surface of the isolation layer facing the substrate.