Micro LED Epitaxial Alignment via Segmented Adhesive Layers
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Solution Overview
Problem
The existing manufacturing processes for micro light emitting diode devices face issues with precise alignment of electrodes due to deformation of adhesive layers under heat or force, leading to defects and reduced manufacturing efficiency and yield.
Innovation Solution
A method involving a connection layer to fix the relative positions of epitaxial structures, followed by the formation of pads and adhesive layers to encapsulate and transfer the structures without shifting, ensuring precise alignment with the circuit substrate's electrodes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive layers are heated and subjected to force during substrate lamination, then substrates can be bonded together, but the adhesive layers deform and cause shifting of epitaxial structures
Solution Approach 1:
The patent divides the adhesive system into multiple layers with different functions: a first adhesive layer for initial bonding and a second adhesive layer for final substrate attachment. This segmentation allows each layer to be optimized for its specific purpose, with the second layer providing enhanced stability during high-force lamination operations.
Solution Approach 2:
The first adhesive layer is applied and cured before the second substrate is attached. This preliminary action creates a stable intermediate structure that prevents epitaxial structure shifting during subsequent high-force bonding operations, ensuring alignment precision is maintained.
2Ease of manufacture
If epitaxial structures are merely bonded to the growth substrate without additional fixation, then the manufacturing process is simple, but the relative positions of epitaxial structures cannot be precisely maintained
Solution Approach 1:
A preliminary adhesive layer is applied to the growth substrate before attaching the epitaxial structures. This preliminary action ensures precise relative positioning is established early in the process and maintained through subsequent manufacturing steps.
Solution Approach 2:
The first adhesive layer acts as an intermediary between the growth substrate and epitaxial structures, providing a bonding interface that maintains precise relative positions while allowing for subsequent processing steps.
3Device complexity
If the first adhesive layer is removed after substrate bonding, then the structure is simplified, but the epitaxial structures may peel off from the growth substrate
Solution Approach 1:
The adhesive system is segmented into multiple layers where the first adhesive layer provides initial bonding and the second adhesive layer provides permanent fixation. This segmentation allows removal of the first layer for simplification while the second layer maintains bonding reliability.
Solution Approach 2:
The second adhesive layer is applied as a preliminary action to ensure permanent bonding reliability before any removal operations occur. This ensures that even if the first layer is removed, the epitaxial structures remain securely bonded.
Data Source
AI summary
A method for manufacturing a micro light emitting diode device is provided. A connection layer and epitaxial structures are formed on a substrate. A first pad is formed on each of the epitaxial structures. A first adhesive layer is formed on the connection layer, and the first adhesive layer encapsulates the epitaxial structures and the first pads. A first substrate is connected to the first adhesive layer. The substrate is removed, and a second substrate is connected to the connection layer through a second adhesive layer. The first substrate and the first adhesive layer are removed. The connection layer located between any two adjacent epitaxial structures are partially removed to form a plurality of connection portions. Each of the connection portions is connected to the corresponding epitaxial structure, and a side edge of each of the connection portions protrudes from a side wall surface of the corresponding epitaxial structure.