Micro LED Epitaxial Structure Alignment via High-Modulus Connection Layer
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing manufacturing process of micro light emitting diode devices faces challenges in precisely aligning electrodes with electrical points on the circuit substrate due to the flow of adhesive layers under heat or force, leading to defects and reduced manufacturing efficiency and yield.
Innovation Solution
The method involves forming epitaxial structures with a connection layer having a higher Young's modulus than the adhesive layer, which fixes the relative positions of the structures, preventing shifts during the lamination process and ensuring precise alignment when transferred to the target substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the adhesive layer is heated and the substrate is laminated, then the bonding strength is improved, but the adhesive layer flows and causes position shift of epitaxial structures
Solution Approach 1:
The patent introduces a connection layer as an intermediary between the epitaxial structure and the adhesive layer. This connection layer has higher viscosity than the adhesive layer, preventing the adhesive from flowing upward during lamination and causing position shifts. The connection layer mediates the bonding process by providing a stable interface that maintains alignment precision while still allowing strong bonding.
Solution Approach 2:
The patent changes the viscosity parameter of the layer between the epitaxial structure and the adhesive layer. By selecting a connection layer with higher viscosity than the adhesive layer, the system prevents adhesive flow during heating and lamination. This parameter change resolves the contradiction by maintaining position stability while achieving strong bonding.
2Ease of manufacture
If the adhesive layer flows under heat or force, then the bonding process is completed, but the relative positions of epitaxial structures are shifted
Solution Approach 1:
The connection layer serves as a mediator that prevents adhesive flow from causing position shifts. During the lamination process, the higher viscosity of the connection layer restricts the movement of the adhesive, allowing the bonding process to proceed easily while maintaining the relative position accuracy of the epitaxial structures.
Solution Approach 2:
The connection layer is formed in advance before the adhesive layer is applied. This preliminary structure provides a stable base that prevents position shifts during subsequent lamination operations, ensuring that the epitaxial structures maintain their relative positions throughout the manufacturing process.
3Device complexity
If the electrodes are not precisely aligned with the electrical points, then the manufacturing process is simplified, but the product reliability is reduced
Solution Approach 1:
The connection layer acts as an intermediary that maintains the precise alignment between electrodes and electrical points on the circuit substrate. By preventing adhesive flow and position shifts, the connection layer ensures reliable electrical connections without requiring complex alignment control mechanisms during the bonding process.
Solution Approach 2:
The patent replaces complex mechanical alignment control systems with a material-based solution. By using a connection layer with appropriate viscosity characteristics, the system achieves precise alignment maintenance through material properties rather than complex mechanical control, simplifying the overall device complexity while ensuring product reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances manufacturing efficiency and yield by maintaining the precise alignment of epitaxial structures, resulting in a micro light emitting diode device with improved reliability.
Implementation Method 1
the Young's modulus of the first connection layer is larger than the Young's modulus of the first adhesive layer... the Young's modulus of the second connection layer is larger than the Young's modulus of the second adhesive layer
Data Source
AI summary
A method for manufacturing a micro light emitting diode device is provided. A plurality of first type epitaxial structures are formed on a first substrate and the first type epitaxial structures are separated from each other. A first connection layer and a first adhesive layer are configured between the first type epitaxial structures and the first substrate. The first connection layer is connected to the first type epitaxial structures. The first adhesive layer is located between the first connection layer and the first type epitaxial substrate. The Young's modulus of the first connection layer is larger than the Young's modulus of the first adhesive layer. The first connection layer located between any two adjacent first type epitaxial structures is removed so as to form a plurality of first connection portions separated from each other. Each of the first connection portions is connected to the corresponding first type epitaxial structure.