Micro-LED Mounting Substrate With Recess-Projection Alignment
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing micro-LED mounting structures face challenges with connection failures due to displacement of micro-LEDs during the mounting process, which can result in unsuccessful electrical connections between the micro-LEDs and the wiring line substrate.
Innovation Solution
The proposed micro-LED mounting substrate incorporates first and second positioning portions on the micro-LEDs and the wiring line substrate, respectively, which are recess-projection-fitted to ensure accurate alignment and positioning of the micro-LEDs, thereby preventing connection failures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If micro-LEDs are mounted on a wiring line substrate using adhesive bonding, then electrical connection and mechanical fixation are achieved, but displacement of micro-LEDs may occur resulting in connection failure
Solution Approach 1:
The patent applies preliminary action by providing positioning portions (protrusions and recesses) on the micro-LEDs and substrate before the bonding process. These positioning features are pre-formed on the micro-LED chips and substrate, ensuring that when the micro-LEDs are placed on the substrate, they are automatically positioned correctly. This preliminary positioning structure prevents displacement during bonding and eliminates the need for post-bonding alignment adjustments, thereby solving the contradiction between connection reliability and positioning accuracy.
Solution Approach 2:
The positioning portions (protrusions and recesses) act as intermediaries between the micro-LEDs and the substrate. These intermediary features facilitate precise alignment and positioning by providing mechanical interlocking that guides the micro-LEDs into their correct positions on the substrate. The positioning portions mediate the interaction between the micro-LEDs and substrate, ensuring accurate placement while maintaining connection reliability during the bonding process.
2Manufacturing precision
If positioning portions are added to micro-LEDs and substrate, then positioning accuracy is improved, but device complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the positioning function into separate, distinct components: protrusions on the micro-LEDs and corresponding recesses on the substrate. This segmentation allows each component to be independently formed and optimized, simplifying the overall manufacturing process. Rather than creating a complex integrated positioning system, the positioning function is segmented into simple geometric features that can be added during standard fabrication processes, thereby improving positioning accuracy without significantly increasing device complexity.
Solution Approach 2:
The positioning portions are implemented with local quality by providing positioning features only at specific locations where alignment is needed, rather than modifying the entire micro-LED or substrate structure. The protrusions and recesses are localized to the bonding interface areas, allowing the rest of the device to maintain its original simple structure. This localized approach achieves high positioning accuracy while minimizing the increase in overall device complexity.
Data Source
AI summary
A micro-LED mounting substrate includes a wiring line substrate provided with at least a plurality of substrate-side connecting portions on one plate surface, a plurality of micro-LEDs disposed side by side in the one plate surface of the wiring line substrate and each including at least a light-emitting face and an LED-side connecting portion provided on a surface opposite to the light-emitting face and connected to the substrate-side connecting portion, a first positioning portion provided on at least a portion of the plurality of micro-LEDs, and facing an installation surface of the substrate-side connecting portion of the wiring line substrate, and a second positioning portion provided on the installation surface of the substrate-side connecting portion of the wiring line substrate and capable of positioning the micro-LEDs including the first positioning portion by being recess-projection-fitted to the first positioning portion.