Micro LED Self-Assembly Using Asymmetric Electrode Positioning
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Solution Overview
Problem
Current display technologies, such as LCDs and OLEDs, face challenges like slow response time, low light efficiency, and short lifespan, while micro LED displays offer high efficiency but struggle with large-scale implementation due to difficulties in transferring and wiring millions of semiconductor light emitting devices.
Innovation Solution
A fabrication method and structure that utilize asymmetrical shapes for semiconductor light emitting devices and receiving grooves on a wiring substrate, allowing self-assembly with magnetic and electric fields to ensure precise positioning and simplify wiring, enabling high-speed, low-cost transfer of micro LEDs onto large-area substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If self-assembly method is used to transfer micro LEDs, then transfer efficiency and productivity are improved, but manufacturing precision and positioning accuracy deteriorate
Solution Approach 1:
The patent applies asymmetry by making the semiconductor light emitting device have an asymmetrical shape that corresponds to the asymmetrical receiving groove. This asymmetric design enables the device to self-align and locate precisely in the groove during self-assembly, resolving the contradiction between transfer efficiency and positioning accuracy by allowing automatic orientation without complex external positioning mechanisms.
2Manufacturing precision
If asymmetrical shape is used for self-assembly, then manufacturing precision and positioning are improved, but device complexity increases
Solution Approach 1:
The asymmetrical shape is applied only to the specific region of the semiconductor light emitting device that interfaces with the receiving groove, rather than the entire device structure. This localized asymmetry achieves precise self-alignment during assembly while minimizing the impact on overall device complexity and maintaining symmetry in other functional regions.
Solution Approach 2:
The patent applies local quality by making only the necessary portion of the semiconductor device asymmetrical - specifically the region that interacts with the receiving groove. The rest of the device structure maintains its conventional symmetrical design, thereby achieving assembly precision where needed without unnecessarily increasing overall device complexity.
3Manufacturing precision
If pick and place method is used for transfer, then positioning accuracy is improved, but productivity and transfer speed deteriorate
Solution Approach 1:
The patent implements self-service by designing the semiconductor light emitting device with an asymmetrical shape that enables it to automatically self-align and self-position within the asymmetrical receiving groove during self-assembly. This eliminates the need for complex external positioning mechanisms and manual pick-and-place operations, thereby achieving both high positioning accuracy and high transfer speed simultaneously.
Solution Approach 2:
The patent replaces the mechanical pick-and-place system with a self-assembly mechanism driven by the asymmetrical shape interaction between the device and receiving groove. This substitution eliminates complex mechanical positioning equipment while achieving precise positioning through the geometric design, thereby improving both productivity and transfer speed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the efficient assembly and wiring of micro LEDs on a large scale, reducing costs and improving transfer yield, enabling the production of high-quality, large-area displays with precise pixelation and selective assembly of red, green, and blue LEDs.
Implementation Method 1
self-assembly with magnetic and electric fields
Implementation Method 2
self-assembly with magnetic and electric fields
Data Source
AI summary
Discussed is a display device, including a semiconductor light emitting device and a substrate having a receiving groove in which the semiconductor light emitting device is accommodated, wherein the semiconductor light emitting device includes a first conductive semiconductor layer, a second conductive semiconductor layer disposed on an upper portion of the first conductive semiconductor layer, a first conductive electrode disposed on the first conductive semiconductor layer and a second conductive electrode disposed on the second conductive semiconductor layer, and spaced apart from the first conductive electrode along a horizontal direction of the semiconductor light emitting device, wherein the first conductive semiconductor layer has a symmetrical shape with respect to at least one direction of the semiconductor light emitting device so that the first conductive electrode and the second conductive electrode are arranged at preset positions when the semiconductor light emitting device is accommodated into the receiving groove.