Micro-LED Display Backplane Bonding Structure to Prevent Short Circuits
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Solution Overview
Problem
The challenge in Micro-LED display technology is to improve bonding efficiency and reliability between Micro-LEDs and their corresponding driving electrodes on the display backboard, particularly due to the small size and close proximity of the Micro-LEDs, which often results in bonding short circuits.
Innovation Solution
A display backboard design featuring connection structures with conductive components and restriction components on the driving electrodes, where the conductive components are aligned with the Micro-LED electrodes and the restriction components prevent bonding material overflow, ensuring secure and reliable electrical connections without short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the distance between adjacent Micro-LED pixels is reduced to micrometer level, then the resolution and brightness are improved, but the bonding reliability deteriorates due to bonding material overflow causing short circuits
Solution Approach 1:
The connection structure is segmented into distinct functional components: a conductive component for electrical connection and a restriction component for confining bonding material. This segmentation allows the bonding material to be contained within specific boundaries, preventing overflow to adjacent pixels while maintaining reliable electrical connection at the micrometer scale.
Solution Approach 2:
The restriction component provides localized confinement of bonding material at critical interfaces between adjacent pixels. By creating a localized barrier structure with specific height and lateral extent, the bonding material is restricted to the intended connection area, enabling high-resolution pixel arrangement without sacrificing bonding reliability.
2Reliability
If the bonding material is applied generously to ensure good electrical connection, then the electrical conductivity is improved, but the bonding material overflows and causes short circuits between adjacent pixels
Solution Approach 1:
The restriction component acts as an intermediary structure between the bonding material and adjacent pixels. It provides a controlled interface that allows sufficient bonding material to be applied for reliable electrical connection while preventing the material from spreading to neighboring pixels, thus eliminating the harmful overflow effect.
Solution Approach 2:
The restriction component extends in the vertical dimension (height direction) to create a three-dimensional confinement structure. By adding this vertical dimension to the bonding interface, the bonding material is contained within defined lateral boundaries while maintaining adequate contact area for electrical connection, resolving the conflict between connection reliability and overflow prevention.
3Ease of manufacture
If the connection structure is designed with larger dimensions to facilitate bonding, then the bonding ease is improved, but the device complexity and area occupation increase
Solution Approach 1:
The connection structure is designed as a universal component that simultaneously provides electrical connection, bonding material confinement, and mechanical support functions. The conductive component and restriction component work together to achieve multiple objectives with a single integrated structure, avoiding the need for separate complex assemblies and simplifying the overall device architecture.
Data Source
Figure 1a~1d
Figure 1e~2a
Figure 2a'~2b'
AI summary
A display backboard and a manufacturing method thereof, and a display device are provided. The display backboard includes: a driving substrate; a plurality of driving electrodes on the driving substrate; and a plurality of connection structures respectively on the plurality of driving electrodes. The connection structure includes: at least one conductive component on the driving electrode; and a restriction component on a side of the driving electrodes provided with the at least one conductive component and in at least a part of a peripheral region of the at least one conductive component. The restriction component protrudes from the driving electrode and has a first height in a direction perpendicular to the driving substrate.