Micro LED Pixel Circuit Layout With Simplified Drive Backplane
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing display technologies face challenges in efficiently driving micro light-emitting diodes (LEDs) due to their small size and complex drive backplane requirements, which affect substrate utilization and manufacturing yield.
Innovation Solution
A light-emitting chip design that includes a pixel circuit layer with simplified drive backplane structure, conductive pads, and a first drive circuit, allowing for flexible drive backplane design and improved substrate utilization, while incorporating a protective layer to enhance reliability and a conductive structure for efficient signal transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If micro LEDs are used to reduce display size and improve brightness, then display performance is improved, but drive backplane complexity increases and substrate utilization decreases
Solution Approach 1:
The patent divides the drive backplane into multiple independent driving units, each capable of driving a specific micro LED. This segmentation allows for simplified individual unit design while maintaining overall system functionality, reducing the complexity burden on any single component of the drive backplane.
Solution Approach 2:
The drive backplane is designed with universal driving units that can drive different types of micro LEDs (different colors, sizes) through standardized interfaces. This multi-functionality reduces the need for specialized complex circuitry for each micro LED type, thereby reducing overall drive backplane complexity.
2Area of moving object
If micro LEDs are used to reduce display size, then display compactness is improved, but substrate utilization ratio decreases
Solution Approach 1:
The patent implements a nested structure where the driving unit is integrated within the pixel circuit layer, which itself is on the substrate. This nesting allows multiple functional layers to occupy the same footprint area, improving substrate utilization ratio while maintaining compact display size.
Solution Approach 2:
The patent transitions from two-dimensional planar arrangement to three-dimensional vertical stacking by placing the driving unit and pixel circuit in different layers. This dimensional change allows more components to be packed into the same substrate area, improving substrate utilization without increasing display footprint.
3Adaptability or versatility
If complex drive backplane structure is used to drive micro LEDs, then driving capability is improved, but manufacturing yield decreases
Solution Approach 1:
The patent standardizes the driving unit parameters (electrode configurations, connection interfaces, circuit layouts) across all driving units. This parameter standardization simplifies the manufacturing process by reducing the variety of configurations that need to be produced, thereby improving manufacturing yield while maintaining full driving capability through the standardized universal design.
Data Source
AI summary
The present disclosure provides a light-emitting chip, a light-emitting device and a display apparatus. The light-emitting chip includes a pixel circuit layer, a light-emitting unit group located on a side of the pixel circuit layer, and a plurality of conductive pads located on a side of the pixel circuit layer facing away from the light-emitting unit. The pixel circuit layer includes at least a part of the structure of the pixel circuit and a plurality of signal lines. The light-emitting unit group includes at least one light-emitting unit, the light-emitting unit is electrically connected with the pixel circuit. One of the conductive pads is electrically connected with one of the signal lines. The light-emitting device includes the plurality of light-emitting chips and the second drive circuit, the plurality of conductive pads are connected with the second drive circuit. The display apparatus includes a light-emitting device.