Micro LED Light Board Backplane Structure for Uniform Spliced Displays
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Solution Overview
Problem
LCD spliced display devices face issues with large splicing gaps and poor brightness uniformity due to the deformation of the driver backplane caused by a significant height difference between the micro LED light board's components, leading to a compromised display effect.
Innovation Solution
A light board design featuring a driver backplane with a base, trace layer, and insulating protection layer, where the insulating protection layer overlaps the traces and includes openings to expose bonding terminals, reducing the height difference and stabilizing the backplane during encapsulation, and a manufacturing method involving molds to ensure proper encapsulation and adhesion of the light-emitting units.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the thickness of the driver backplane is strictly controlled to reduce height difference with the LCD display panel, then the height difference is reduced, but the deformation resistance of the driver backplane is weakened
Solution Approach 1:
The driver backplane is constructed as a composite structure with a base layer and an insulating protection layer stacked together. This composite design allows the backplane to maintain a controlled overall thickness to reduce height difference with the LCD panel, while the combined structure provides sufficient deformation resistance that a single thin layer could not achieve alone.
2Reliability
If the thickness of the white screen-printing ink is increased to ensure electrical connection, then the electrical connection is improved, but the height difference between the lowest point and highest point of the driver backplane side is increased
Solution Approach 1:
The insulating protection layer is introduced to cover and isolate the thick white screen-printing ink and black ink layer. This extraction of the insulating function into a separate layer allows the conductive layers to be sufficiently thick for reliable electrical connection without contributing to the height difference problem, as the insulating layer provides a flat outer surface.
Solution Approach 2:
The solution moves from a single-layer thickness control approach to a multi-layer stacked structure. By adding the insulating protection layer on top of the conductive layers, the design separates the electrical connection function (achieved through thick conductive layers) from the height control function (achieved through the overall stacked structure thickness).
3Ease of manufacture
If the driver backplane is pressed during encapsulation to encapsulate the LED array, then the encapsulation is achieved, but the deformation of the driver backplane is large due to the large height difference
Solution Approach 1:
The composite structure of the base layer and insulating protection layer creates a more uniform and stable backplane that resists deformation during the encapsulation pressing process. The layered construction distributes the applied pressure more evenly, preventing the large deformations that occur in single-layer thin backplanes with height variations.
4Object-affected harmful factors
If the insulating protection layer is disposed on the outermost side of the driver backplane, then the traces are protected and the height difference is reduced, but the bonding terminals need to be exposed through openings
Solution Approach 1:
The insulating protection layer is applied universally across the driver backplane to provide comprehensive protection, but with local exceptions where openings are created to expose bonding terminals. This local quality modification allows the general protective function to be maintained while enabling necessary electrical connections at specific locations.
Data Source
AI summary
A light board includes a light-emitting unit array including a plurality of light-emitting units arranged in an array and a driver backplane disposed on a backlight side of the light-emitting unit array. The driver backplane includes a base, a trace layer, and an insulating protection layer stacked successively in a direction away from the light-emitting unit array. The trace layer includes a plurality of traces and one or more bonding terminals each electrically connected to one of the traces. An orthographic projection of the insulating protection layer on the base overlaps the traces. The insulating protection layer includes one or more first opening each exposing one of the bonding terminals. The insulating protection layer is disposed on an outermost side of the side of the driver backplane away from the light-emitting unit array.