Micro-LED Pixel Repair with Backup Recesses and Fluid Transfer

The patent applies preliminary action by pre-transferring a large number of main micro-LED chips to the substrate before defect detection and repair. The main micro-LED chips are transferred in advance and positioned in main recesses, so when defects are detected, the repair process can immediately use pre-positioned backup chips without needing to perform individual chip placement operations for each defective pixel, thereby dramatically improving repair efficiency

The patent uses fluid mass transfer method (hydraulic principle) to transfer micro-LED chips. A suspension containing micro-LED chips is flowed through the substrate to simultaneously transfer multiple chips to their designated positions. This fluid-based mass transfer approach enables parallel transfer of many chips in one operation, replacing the traditional sequential mechanical placement method and significantly reducing the time and operations required for chip transfer

The patent merges multiple repair operations into a single streamlined process. Instead of performing separate removal and placement operations for each defective pixel, the method combines defect detection, backup chip selection, and chip transfer into an integrated workflow. The fluid mass transfer method further merges the transfer of multiple backup chips into a single bulk operation, reducing the number of discrete steps and simplifying the overall repair process

The patent implements self-service by having the system automatically detect defective pixels and autonomously select and transfer appropriate backup chips without requiring manual intervention for each repair operation. The detection system identifies defective pixels, and the fluid mass transfer process automatically delivers backup chips to the correct positions, enabling the repair system to service itself without complex manual操作流程