Micro LED Protective Coating for Bubble-Free Barrier Packaging
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Solution Overview
Problem
Current micro light emitting diode (Micro LED) display panel packaging methods using transparent optical adhesive or organic resin are complex, costly, and prone to bubbles, with poor water vapor and oxygen blocking properties, leading to reduced product lifespan.
Innovation Solution
A micro light emitting diode display panel is fabricated using a driving circuit substrate with micro LEDs on one surface and a protective layer made from a Parylene system or acrylic acid system, which is deposited using chemical vapor deposition or atomic layer deposition to improve packaging performance and simplify the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If transparent optical adhesive is used for packaging Micro LED chips, then the filling effect is improved, but the process becomes complicated and bubbles may form
Solution Approach 1:
The patent extracts and removes the problematic packaging process steps (heating, pressurization, vacuum defoaming, UV curing) by adopting a transfer printing method that places Micro LED chips directly on the substrate without requiring these complex packaging operations, thereby simplifying the overall process while maintaining good filling effect
Solution Approach 2:
The patent replaces the mechanical/thermal packaging system (heating, pressurization, vacuum) with a direct transfer printing approach that uses controlled placement and adhesion, eliminating the need for complex equipment and processes while achieving comparable or superior packaging quality
2Manufacturing precision
If transparent optical adhesive is used for packaging Micro LED chips, then the filling effect is improved, but water vapor and oxygen blocking properties deteriorate
Solution Approach 1:
The patent employs composite material structures including encapsulation layers with excellent water vapor and oxygen barrier properties, combining multiple material functions (structural support, optical transmission, and environmental barrier) to protect Micro LED chips from degradation while maintaining packaging quality
Solution Approach 2:
The patent uses thin film encapsulation layers that provide effective barrier properties against water vapor and oxygen penetration, creating a protective shell around the Micro LED chips without compromising the filling effect or requiring complex packaging processes
3Strength
If organic resin adhesive is used for packaging Micro LED chips, then the adhesive strength is improved, but the frame width increases and seamless splicing becomes difficult
Solution Approach 1:
The patent extracts and eliminates the need for wide process edges and complex edge removal operations by using transfer printing technology that places Micro LED chips precisely without requiring adhesive overflow prevention margins, enabling narrow frame designs and seamless splicing while maintaining adequate adhesive strength at the actual bonding interfaces
Solution Approach 2:
The patent changes the bonding mechanism from broad-area adhesive bonding requiring wide edges to precise point-or-line contact bonding through transfer printing, allowing the bonding interface to be confined to minimal dimensions necessary for mechanical and electrical connection, thereby reducing frame width while preserving adhesive strength where needed
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution enhances the packaging performance of Micro LED display panels, reduces production costs, and achieves a narrow frame with seamless splicing, while extending the product's service life by effectively blocking water vapor and oxygen.
Implementation Method 1
depositing a protective material on the driving circuit substrate, the protective material covers the plurality of micro light emitting diodes, and the protective material is selected from a Parylene system or an acrylic acid system
Implementation Method 2
depositing a protective material on the driving circuit substrate, the protective material covers the plurality of micro light emitting diodes, and the protective material is selected from a Parylene system or an acrylic acid system
Implementation Method 3
the optical adhesive material has poor blocking properties against water vapor and oxygen, resulting in insufficient packaging of a side of the display panel, water and oxygen can easily enter the panel from the side of the product
Data Source
AI summary
Disclosed are a micro light emitting diode display panel, a method of manufacturing the same, and a display device. The micro light emitting diode display panel includes a driving circuit substrate, a plurality of micro light emitting diodes, and a protective layer. The plurality of micro light emitting diodes are disposed on a first surface of the driving circuit substrate. The protective layer is disposed at least on the first surface of the driving circuit substrate and covers the micro light emitting diodes. A material of the protective layer is selected from a Parylene system or an acrylic acid system.