Micro LED Barrier Layer Segmentation for Alignment Stability

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Solution Overview

Problem

The alignment tolerances and patterning errors during the panel process of micro LED displays, particularly due to thermal expansion and bending of the substrate and barrier layer, result in misalignment of the micro LEDs, affecting brightness and assembly accuracy.

Innovation Solution

Incorporation of stress separation lines on the substrate, including compensation lines, to manage thermal expansion and prevent bending, ensuring precise alignment and reduced alignment errors by distributing stress effectively.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a barrier layer is formed on the substrate and a curing process is performed, then the barrier layer is cured and provides protection, but the barrier layer expands due to thermal or ultraviolet curing, causing the assembly hole pattern to move and misalignment with the electrode

Engineering Contradiction:
Improvebarrier layer protectionVSAvoidassembly hole alignment
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The barrier layer is divided into multiple segments by introducing stress separation lines that extend from the center of the substrate to the edges. These lines segment the barrier layer into radial sections, allowing each segment to expand independently during curing without causing overall pattern displacement. This segmentation resolves the contradiction by maintaining structural integrity and protection while preventing misalignment.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The stress separation lines are strategically positioned at specific radial distances from the substrate center, creating zones with different stress distribution characteristics. The local quality of the barrier layer is modified by these lines, which act as stress relief pathways in specific locations while maintaining barrier functionality in other areas, thus preventing expansion-induced misalignment.

Inventive Principle:
Principle #3Local quality

2Productivity

If the substrate and barrier layer structure is formed during the panel process, then the display device is manufactured, but bending occurs in the structure due to thermal expansion, causing patterning errors at outer locations

Engineering Contradiction:
Improvepanel process efficiencyVSAvoidwiring and assembly hole patterning
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The barrier layer is divided into multiple segments by introducing stress separation lines that extend from the center of the substrate to the edges. These lines segment the barrier layer into radial sections, allowing each segment to expand independently during curing without causing overall pattern displacement. This segmentation resolves the contradiction by maintaining structural integrity and protection while preventing misalignment.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The stress separation lines are strategically positioned at specific radial distances from the substrate center, creating zones with different stress distribution characteristics. The local quality of the barrier layer is modified by these lines, which act as stress relief pathways in specific locations while maintaining barrier functionality in other areas, thus preventing expansion-induced misalignment.

Inventive Principle:
Principle #3Local quality

3Ease of manufacture

If micro LEDs are assembled using the barrier layer assembly holes, then the display device is constructed, but alignment tolerances cause deviations in micro LED position, affecting brightness or causing failure to light up

Engineering Contradiction:
Improvemicro LED assemblyVSAvoidmicro LED position alignment
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The barrier layer is divided into multiple segments by introducing stress separation lines that extend from the center of the substrate to the edges. These lines segment the barrier layer into radial sections, allowing each segment to expand independently during curing without causing overall pattern displacement. This segmentation resolves the contradiction by maintaining structural integrity and protection while preventing misalignment.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The stress separation lines are strategically positioned at specific radial distances from the substrate center, creating zones with different stress distribution characteristics. The local quality of the barrier layer is modified by these lines, which act as stress relief pathways in specific locations while maintaining barrier functionality in other areas, thus preventing expansion-induced misalignment.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The stress separation lines minimize alignment errors and maintain the position of assembly holes, enhancing the accuracy and reliability of micro LED display assembly by mitigating stress from thermal expansion and curing processes.

Implementation Method 1

Since this curing process is a high temperature process, the barrier layer may expand. Accordingly, the mounting space (assembly hole pattern) formed at the location where the light emitting device is to be mounted may be moved.

Methodology Applied
Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS12364065B2Display apparatus using semiconductor light-emitting device, and manufacturing method therefor
Publication Date: 2025.07.15 LG ELECTRONICS INC
  • US12364065B2 patent drawing
  • US12364065B2 patent drawing
  • US12364065B2 patent drawing

AI summary

The present invention is applicable to display device-related technical fields and, for example, relates to a display device using micro LED (Light Emitting Diode) and a method of manufacturing the same. The present invention includes a substrate including a pixel area and a pad area located around the pixel area; a barrier layer located on the substrate and defining a plurality of unit pixel areas within the pixel area; a stress separation line located between the unit pixel areas on the barrier layer; a first electrode located in the unit pixel area; a semiconductor light emitting device in which a first type electrode is electrically connected to the first electrode within the unit pixel area; a coating layer formed on the semiconductor light emitting device and the barrier layer; and a second electrode electrically connected to the type second electrode of the semiconductor light emitting device on the coating layer.