Single-Substrate Micro LED Display Bending Without Wire Disconnection
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Solution Overview
Problem
Micro LED display devices face issues with side wire disconnection during bending due to separate upper and lower substrates, leading to product defects and increased manufacturing complexity, and require additional processes for signal transmission and protective structures.
Innovation Solution
A micro LED display device design that uses a single substrate with a front panel region, a rear panel region, and a bending region, where connection wires extend from the front panel to the rear panel through the bending region, ensuring the side wires are wider and securely connected to prevent disconnection, and omits the need for separate lower substrates and additional protective structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If separate upper and lower substrates are used with side wires for electrical connection, then the display device can be manufactured with modular components, but the side wires may disconnect during bending leading to product defects
Solution Approach 1:
The patent merges the upper substrate and lower substrate into a single integrated substrate structure. The front panel region, bending region, and rear panel region are formed as one continuous substrate, eliminating the need for separate substrates and side wires to connect them. This integration ensures that connection wires extend continuously from the front panel through the bending region to the rear panel without disconnection risks.
Solution Approach 2:
The patent employs a flexible substrate design that can be bent without causing wire disconnection. The single substrate is configured to accommodate bending in a specific region, allowing the display device to achieve flexibility while maintaining continuous electrical connections through the bent area.
2Adaptability or versatility
If separate lower substrate and chip-on-film are used, then the integrated circuit can be mounted separately, but additional processes and protective structures are required increasing device complexity
Solution Approach 1:
The patent combines the lower substrate and chip-on-film functions into the single integrated substrate. The rear panel region of the substrate directly supports the integrated circuit chip, eliminating the need for a separate chip-on-film layer and reducing the total number of manufacturing processes while maintaining circuit mounting flexibility.
Solution Approach 2:
The single substrate serves multiple functions: it acts as the front panel support, provides the bending region for flexibility, serves as the rear panel support, and directly mounts the integrated circuit chip. This multi-functional design reduces device complexity while maintaining versatility.
3Productivity
If traditional substrate structure is used, then manufacturing processes are established, but the device thickness and weight are greater than necessary
Solution Approach 1:
The patent extracts and eliminates redundant structural layers from the traditional multi-substrate design. By removing the separate lower substrate and chip-on-film layers, and consolidating their functions into the single substrate, the overall device thickness and weight are reduced while maintaining manufacturing stability.
Data Source
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AI summary
Disclosed is a display device (100, 200, 300, 400, 500, 600) including a substrate (FSUB) comprising a front panel region (FPN), a rear panel region (BPN) and a bending region (BDA) disposed between the front panel region (FPN) and the rear panel region (BPN); a display region (AA) located in the front panel region (FPN), a plurality of light emitting elements (ED) being disposed on the display region (AA); an integrated circuit chip (IC) disposed on the rear panel region (BPN); and connection wires (LE) extending from the front panel region (FPN) to the rear panel region (BPN) of the substrate (FSUB) through the bending region (BDA), and the rear panel region (BPN) of the substrate (FSUB) may be secured to a lower portion of the substrate (FSUB) that corresponds to the front panel region (FPN).