Multilayer Micro LED Board Layout for Uniform Thickness and Heat Dissipation
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Solution Overview
Problem
Multilayer board structures with flexible substrates face issues such as thickness variations leading to connection failures, tilting of LEDs, inefficient heat dissipation, and short-circuits due to uneven thickness distribution of metal patterns, which affect the performance and reliability of micro LED display devices.
Innovation Solution
A multilayer board structure with uniform metal layer distribution across stacked substrates ensures consistent thickness and efficient heat dissipation by aligning the number of metal layers beneath each electrode, using through holes for electrical connections, and incorporating dummy patterns to stabilize the LED devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If metal patterns are formed on flexible substrates in a multilayer structure, then electrical connections between light emitting devices and circuits are enabled, but thickness variations occur leading to connection failures and tilting
Solution Approach 1:
The patent applies local quality by forming dummy metal patterns only in specific regions where thickness compensation is needed, rather than uniformly across the entire substrate. The dummy patterns are strategically placed to compensate for local thickness variations caused by metal wiring patterns, thereby achieving uniform overall thickness while maintaining electrical connection functionality.
Solution Approach 2:
The patent changes the parameter of metal layer distribution by introducing dummy metal patterns with specific area ratios (0.1-10 times the area of light emitting device metal patterns). This parameter adjustment compensates for the thickness variations introduced by functional metal patterns, achieving uniform thickness distribution across the flexible substrate.
2Ease of manufacture
If metal patterns with different areas are formed for light emitting devices, then electrical connections are established, but thickness distribution becomes uneven causing connection failures
Solution Approach 1:
The patent applies local quality by differentiating between functional metal patterns (for electrical connections) and dummy metal patterns (for thickness compensation). The dummy patterns are selectively added only where thickness deficiency occurs, creating a non-uniform distribution that actually achieves uniform overall thickness, thereby improving connection reliability.
Solution Approach 2:
The patent applies beforehand cushioning by pre-forming dummy metal patterns before finalizing the complete metal layer structure. These dummy patterns act as a cushion or compensation mechanism that counteracts the thickness variations that would otherwise cause connection failures, ensuring reliable connections from the outset.
3Adaptability or versatility
If flexible substrates are used for curved displays, then immersion and flexibility are improved, but heat dissipation efficiency deteriorates
Solution Approach 1:
The patent applies local quality by creating extended metal pattern regions with high thermal conductivity properties at specific locations beneath the light emitting devices. These localized high-conductivity regions act as heat sinks, efficiently conducting heat away from the devices while the overall flexible substrate maintains its bendability and adaptability for curved displays.
Solution Approach 2:
The patent employs composite materials by combining flexible substrate materials with high thermal conductivity metal patterns. This composite structure integrates the flexibility needed for curved displays with the thermal conductivity required for efficient heat dissipation, achieving both adaptability and thermal management performance simultaneously.
4Reliability
If through holes are formed for electrical connections, then connection reliability is improved, but manufacturing complexity increases
Solution Approach 1:
The patent applies parameter changes by optimizing the dimensions, positions, and material compositions of through holes to achieve reliable electrical connections with controlled manufacturing complexity. The through holes are designed with specific size ranges and spatial arrangements that balance connection reliability against the complexity of formation processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves uniform board thickness, reliable electrical connections, aligned optical axes, and efficient heat dissipation, preventing defects and improving the front luminance and reliability of micro LED devices.
Implementation Method 1
remaining substrates of the plurality of stacked substrates, other than the uppermost substrate, have surfaces formed with metal layers
Data Source
AI summary
A multilayer board structure includes a plurality of light emitting devices, each light emitting device of the plurality of light emitting devices having a plurality of electrodes formed on a terminal surface thereof, and a multilayer board including a plurality of stacked substrates and implemented with the plurality of light emitting devices. An uppermost substrate of the plurality of stacked substrates has a surface formed with metal layers coupling electrodes of the plurality of light emitting devices. Remaining substrates of the plurality of stacked substrates, other than the uppermost substrate, have surfaces formed with metal layers, respectively. A number of metal layers located directly below the electrodes of the plurality of light emitting devices is the same for each of the electrodes.