Micro LED Electrode Layout With Bonding Spread Barriers
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Solution Overview
Problem
The existing pick and place method for transferring micro LEDs onto a substrate in micro LED display apparatuses results in low productivity due to reduced micro LED size and increased display area, leading to high bonding failure rates.
Innovation Solution
Incorporation of a bonding spread prevention portion with structures such as valleys, dams, or holes between electrodes to prevent the spread of bonding material, thereby reducing short-circuiting and enhancing bonding reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the micro LED size is reduced and display area is increased to improve display resolution, then display quality is improved, but bonding failure rate increases
Solution Approach 1:
The patent introduces a bonding spread prevention portion with specific structural features (valley structure, damper structure, protruding dam) at localized positions between electrodes. These structures create different local properties in the bonding material flow path, guiding the bonding material to flow along predetermined paths and preventing short-circuiting between adjacent electrodes, thereby resolving the bonding failure issue while maintaining small micro LED sizes for high resolution displays
2Ease of manufacture
If the pick and place method is used to transfer micro LEDs onto substrate, then transfer process is simple, but productivity is low
Solution Approach 1:
The patent designs the bonding spread prevention portion structures (valley, damper, or protruding dam) to be formed beforehand on the micro LED or substrate before the bonding process. These pre-formed structures automatically guide the bonding material flow during the bonding process, eliminating the need for complex real-time control mechanisms and enabling high-speed bonding processes while maintaining high precision, thus improving productivity without sacrificing transfer process simplicity
Data Source
AI summary
A micro light emitting device, a display apparatus including the same, and a method of manufacturing the micro light emitting device are disclosed. The micro light emitting device includes a first type semiconductor layer; a light emitting layer provided on the first type semiconductor layer; a second type semiconductor layer provided on the light emitting layer; one or more first type electrodes provided on the second type semiconductor layer; one or more second type electrodes provided on the second type semiconductor layer and spaced apart from the one or more first type electrodes; and a bonding spread prevention portion provided between the one or more first type electrodes and the one or more second type electrodes.