Micro LED Display Panel Redundant Bonding Pad Structure
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Solution Overview
Problem
Micro LED display panels face challenges in bonding due to the small size of micro LEDs, leading to short circuits and structural weakness, which can result in failed pixels and reduced manufacturing yield and image quality.
Innovation Solution
The design includes a backplane with sub-pixels having multiple bonding pads, where micro LEDs are electrically connected through a first and second electrical carrier path, with the second carrier path utilizing a conductive device for redundancy in case of bonding failures, ensuring reliable electrical connection and reduced defect pixels.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the width of P-type electrode and N-type electrode is reduced to increase spacing between electrodes, then short circuit risk is reduced, but the micro LED structure becomes weak and cracks easily
Solution Approach 1:
The bonding pad structure is segmented into two types: first-type pads for P-type electrode connection and second-type pads for N-type electrode connection. This segmentation allows different pad configurations optimized for their respective electrode connections, enabling adequate spacing between P and N electrodes while maintaining sufficient pad area for reliable bonding without requiring proportional reduction of all electrode dimensions.
2Reliability
If multiple bonding pads are used for electrical connection, then alignment difficulty is reduced and bonding reliability is improved, but device complexity increases
Solution Approach 1:
Different bonding pads are assigned different functions and configurations based on local requirements. First-type bonding pads are specifically designed for P-type electrode connections while second-type bonding pads are designed for N-type electrode connections. This local differentiation optimizes each pad for its specific purpose, improving overall bonding reliability without requiring a uniform increase in complexity across the entire device structure.
3Manufacturing precision
If micro LED size is reduced for higher resolution, then display quality is improved, but transfer and bonding process becomes more difficult
Solution Approach 1:
The bonding pad structure extends in multiple dimensions to compensate for the reduced micro LED size. By creating a multi-dimensional bonding pad configuration with different pad types arranged in specific spatial relationships, the bonding target area is effectively increased, making it easier to achieve accurate alignment and reliable bonding even when the micro LED dimensions are reduced for higher display resolution.
Data Source
AI summary
A display panel including a backplane and a plurality of micro LEDs is provided. The backplane includes a plurality of sub-pixels. Each of the sub-pixels has N sets of bonding pad. Each set of bonding pads includes a first electrical pad and X second electrical pads. N is an integer of 1˜3, X is an integer of 2˜4. The micro LEDs are respectively disposed in the sub-pixels, and the micro LED is electrically connected to one corresponding set of bonding pads of the N bonding pad sets. A first electrical carrier and a second electrical carrier are provided by the backplane to each of the micro LEDs through the one corresponding set of bonding pads.