Micro LED Electrode Layout to Prevent Bonding Spread Failures
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Solution Overview
Problem
The existing pick and place method for transferring micro LEDs onto substrates is inefficient, leading to low productivity and increased bonding failures as the size of micro LEDs decreases and the size of displays increases.
Innovation Solution
A micro light emitting device is designed with a bonding spread prevention portion between the electrodes, which can include valley structures, damper structures, trenches, or holes to prevent the flow of bonding material and reduce the risk of short-circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the size of micro LED is reduced, then the resolution and density of display apparatus is improved, but bonding failures increase
Solution Approach 1:
The patent divides the bonding region into distinct zones by introducing a bonding spread prevention portion that segments the bonding material flow path. This prevents bonding material from spreading to adjacent electrodes, thereby maintaining bonding reliability even as micro LED size is reduced for higher display resolution.
Solution Approach 2:
The bonding spread prevention portion acts as an intermediary structure between electrodes, controlling the flow of bonding material. This intermediary element prevents direct contact between bonding material and electrodes that would cause short circuits, thus improving bonding success rate while allowing smaller LED sizes.
2Area of stationary object
If the size of display is increased, then the coverage area is improved, but bonding failures increase due to larger number of micro LEDs
Solution Approach 1:
By segmenting the bonding region with prevention portions, each bonding site becomes an isolated controlled environment. This allows the display area to be scaled up with more micro LEDs while maintaining consistent bonding reliability at each individual bonding site.
3Ease of manufacture
If conventional pick and place method is used, then the transfer process is simple, but productivity is low
Solution Approach 1:
The bonding spread prevention portion is formed in advance during the micro LED fabrication process, before the transfer step. This preliminary structuring enables faster and more reliable bonding during the transfer process, improving productivity without complicating the overall manufacturing flow.
Data Source
AI summary
A micro light emitting device, a display apparatus including the same, and a method of manufacturing the micro light emitting device are disclosed. The micro light emitting device includes a first type semiconductor layer; a light emitting layer provided on the first type semiconductor layer; a second type semiconductor layer provided on the light emitting layer; one or more first type electrodes provided on the second type semiconductor layer; one or more second type electrodes provided on the second type semiconductor layer and spaced apart from the one or more first type electrodes; and a bonding spread prevention portion provided between the one or more first type electrodes and the one or more second type electrodes.